SLVSFW2B August   2022  – February 2024 TPS543B22

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  VIN Pins and VIN UVLO
      2. 6.3.2  Internal Linear Regulator and Bypassing
      3. 6.3.3  Enable and Adjustable UVLO
        1. 6.3.3.1 Internal Sequence of Events During Start-Up
      4. 6.3.4  Switching Frequency Selection
      5. 6.3.5  Switching Frequency Synchronization to an External Clock
        1. 6.3.5.1 Internal PWM Oscillator Frequency
        2. 6.3.5.2 Loss of Synchronization
        3. 6.3.5.3 Interfacing the SYNC/FSEL Pin
      6. 6.3.6  Remote Sense Amplifier and Adjusting the Output Voltage
      7. 6.3.7  Loop Compensation Guidelines
        1. 6.3.7.1 Output Filter Inductor Tradeoffs
        2. 6.3.7.2 Ramp Capacitor Selection
        3. 6.3.7.3 Output Capacitor Selection
        4. 6.3.7.4 Design Method for Good Transient Response
      8. 6.3.8  Soft Start and Prebiased Output Start-Up
      9. 6.3.9  MSEL Pin
      10. 6.3.10 Power Good (PG)
      11. 6.3.11 Output Overload Protection
        1. 6.3.11.1 Positive Inductor Current Protection
        2. 6.3.11.2 Negative Inductor Current Protection
      12. 6.3.12 Output Overvoltage and Undervoltage Protection
      13. 6.3.13 Overtemperature Protection
      14. 6.3.14 Output Voltage Discharge
    4. 6.4 Device Functional Modes
      1. 6.4.1 Forced Continuous-Conduction Mode
      2. 6.4.2 Discontinuous Conduction Mode During Soft Start
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 1.0-V Output, 1-MHz Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2  Switching Frequency
          3. 7.2.1.2.3  Output Inductor Selection
          4. 7.2.1.2.4  Output Capacitor
          5. 7.2.1.2.5  Input Capacitor
          6. 7.2.1.2.6  Adjustable Undervoltage Lockout
          7. 7.2.1.2.7  Output Voltage Resistors Selection
          8. 7.2.1.2.8  Bootstrap Capacitor Selection
          9. 7.2.1.2.9  VDRV and VCC Capacitor Selection
          10. 7.2.1.2.10 PGOOD Pullup Resistor
          11. 7.2.1.2.11 Current Limit Selection
          12. 7.2.1.2.12 Soft-Start Time Selection
          13. 7.2.1.2.13 Ramp Selection and Control Loop Stability
          14. 7.2.1.2.14 MODE Pin
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Performance
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7.2.1.2.5 Input Capacitor

Input decoupling ceramic capacitors type X5R, X7R, or similar from VIN to PGND that are placed as close as possible to the IC are required. A total of at least 66 µF of capacitance is required and some applications can require a bulk capacitance. TI recommends at least 1 µF of bypass capacitance as close as possible to each VIN pin to minimize the input voltage ripple. A 1-µF capacitor must be placed as close as possible to both VIN pins 4 and 9 on the same side of the board of the device to provide high frequency bypass to reduce the high frequency overshoot and undershoot on VIN and SW pins. The voltage rating of the input capacitor must be greater than the maximum input voltage. The capacitor must also have a ripple current rating greater than the maximum RMS input current. The RMS input current can be calculated using Equation 26.

For this example design, a ceramic capacitor with at least a 25-V voltage rating is required to support the maximum input voltage. Two 22-µF, 1210, X7R, 25-V, two 10-µF, 0805, X7S, 25-V, and two 1-μF, 0402 or 0603, X7R 25-V capacitors in parallel has been selected to be placed on both sides of the IC near both VIN pins to PGND pins. Based on the capacitor manufacturer's website, the total ceramic input capacitance derates to 25 µF at the nominal input voltage of 12 V. Additional 100-µF ceramic capacitance and 220-µF aluminum electrolytic are also used to bypass long leads when connected a lab bench top power supply.

The input capacitance value determines the input ripple voltage of the regulator. The input voltage ripple can be calculated using Equation 26. The maximum input ripple occurs when operating nearest to 50% duty cycle. Using the nominal design example values of IOUT(MAX) = 20 A , CIN = 25 μF, and fSW = 1000 kHz, the input voltage ripple with the 12-V nominal input is 61 mV and the RMS input ripple current with the 4.5-V minimum input is 8.3 A.

Equation 26. I C I N R M S = I O U T ×       V I N M I N   -   V O U T V I N M I N × V O U T V I N M I N

Equation 27. ∆ V I N = I O U T M A X   ×   1   -   V O U T V I N   ×   V O U T V I N C I N   ×   f s w