SLUSDE0
December 2018
TPS543C20A
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Simplified Schematic
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
8.4.1
Soft-Start Operation
8.4.2
Input and VDD Undervoltage Lockout (UVLO) Protection
8.4.3
Power Good and Enable
8.4.4
Voltage Reference
8.4.5
Prebiased Output Start-up
8.4.6
Internal Ramp Generator
8.4.6.1
Ramp Selections
8.4.7
Switching Frequency
8.4.8
Clock Sync Point Selection
8.4.9
Synchronization and Stackable Configuration
8.4.10
Dual-Phase Stackable Configurations
8.4.10.1
Configuration 1: Master Sync Out Clock-to-Slave
8.4.10.2
Configuration 2: Master and Slave Sync to External System Clock
8.4.11
Operation Mode
8.4.12
API/Body Brake
8.4.13
Sense and Overcurrent Protection
8.4.13.1
Low-Side MOSFET Overcurrent Protection
8.4.13.2
High-Side MOSFET Overcurrent Protection
8.4.14
Output Overvoltage and Undervoltage Protection
8.4.15
Overtemperature Protection
8.4.16
RSP/RSN Remote Sense Function
8.4.17
Current Sharing
8.4.18
Loss of Synchronization
9
Application and Implementation
9.1
Application Information
9.2
Typical Application: TPS543C20A Stand-alone Device
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Custom Design With WEBENCH® Tools
9.2.2.2
Switching Frequency Selection
9.2.2.3
Inductor Selection
9.2.2.4
Input Capacitor Selection
9.2.2.5
Bootstrap Capacitor Selection
9.2.2.6
BP Pin
9.2.2.7
R-C Snubber and VIN Pin High-Frequency Bypass
9.2.2.8
Output Capacitor Selection
9.2.2.8.1
Response to a Load Transient
9.2.2.8.2
Ramp Selection Design to Ensure Stability
9.2.3
Application Curves
9.3
System Example
9.3.1
Two-Phase Stackable
9.3.1.1
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.3
Package Size, Efficiency and Thermal Performance
12
Device and Documentation Support
12.1
Device Support
12.1.1
Development Support
12.1.1.1
Custom Design With WEBENCH® Tools
12.1.2
Documentation Support
12.1.2.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RVF|40
MPQF268C
Thermal pad, mechanical data (Package|Pins)
RVF|40
QFND333E
Orderable Information
slusde0_oa
slusde0_pm
8.2
Functional Block Diagram