SLVS757E March   2007  – July 2022 TPS5450

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Oscillator Frequency
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Enable (ENA) and Internal Slow-Start
      4. 7.3.4  Undervoltage Lockout (UVLO)
      5. 7.3.5  Boost Capacitor (BOOT)
      6. 7.3.6  Output Feedback (VSENSE) and Internal Compensation
      7. 7.3.7  Voltage Feed-Forward
      8. 7.3.8  Pulse-Width-Modulation (PWM) Control
      9. 7.3.9  Overcurrent Limiting
      10. 7.3.10 Overvoltage Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation near Minimum Input Voltage
      2. 7.4.2 Operation With ENA Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Filter Components
        5. 8.2.2.5 Inductor Selection
        6. 8.2.2.6 Capacitor Selection
        7.       43
        8. 8.2.2.7 Boot Capacitor
        9. 8.2.2.8 Catch Diode
        10. 8.2.2.9 Advanced Information
          1. 8.2.2.9.1 Output Voltage Limitations
          2. 8.2.2.9.2 Internal Compensation Network
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Calculations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2 Detailed Design Procedure

The following design procedure can be used to select component values for the TPS5450. Alternately, use the WEBENCH software to generate a complete design. The WEBENCH software uses an iterative design procedure and accesses a comprehensive database of components when generating a design. This section presents a simplified discussion of the design process.