SLVSF00 January   2019 TPS54560B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Load Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation Output Current
      3. 7.3.3  Pulse Skip Eco-mode
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Internal Soft Start
      9. 7.3.9  Constant Switching Frequency and Timing Resistor (RT/CLK) pin)
      10. 7.3.10 Accurate Current-Limit Operation and Maximum Switching Frequency
      11. 7.3.11 Synchronization to RT/CLK pin
      12. 7.3.12 Overvoltage Protection
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Small Signal Model for Loop Response
      15. 7.3.15 Simple Small Signal Model for Peak-Current-Mode Control
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN < 4.5 V (Minimum VIN)
      2. 7.4.2 Operation with EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH® Tools
        2. 8.2.2.2  Selecting the Switching Frequency
        3. 8.2.2.3  Output Inductor Selection (LO)
        4. 8.2.2.4  Output Capacitor
        5. 8.2.2.5  Catch Diode
        6. 8.2.2.6  Input Capacitor
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  Undervoltage Lockout Setpoint
        9. 8.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 8.2.2.10 Minimum Input Voltage, VIN
        11. 8.2.2.11 Compensation
        12. 8.2.2.12 Discontinuous Conduction Mode and Eco-mode Boundary
        13. 8.2.2.13 Power Dissipation Estimate
        14. 8.2.2.14 Safe Operating Area
      3. 8.2.3 Application Curves
    3. 8.3 Other System Examples
      1. 8.3.1 Inverting Power
      2. 8.3.2 Split-Rail Power Supply
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Estimated Circuit Area
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Custom Design with WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS54560B UNIT
DDA (HSOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 42 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.8 °C/W
RθJB Junction-to-board thermal resistance 23.4 °C/W
ψJT Junction-to-top characterization parameter 5.9 °C/W
ψJB Junction-to-board characterization parameter 23.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.