SLVSBO1G July   2013  – June 2021 TPS54561

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation Output Current
      3. 7.3.3  Pulse Skip Eco-mode
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Soft Start/Tracking Pin (SS/TR)
      9. 7.3.9  Sequencing
      10. 7.3.10 Constant Switching Frequency and Timing Resistor (RT/CLK) Pin)
      11. 7.3.11 Maximum Switching Frequency
      12. 7.3.12 Synchronization to RT/CLK Pin
      13. 7.3.13 Accurate Current Limit Operation
      14. 7.3.14 Power Good (PWRGD Pin)
      15. 7.3.15 Overvoltage Protection
      16. 7.3.16 Thermal Shutdown
      17. 7.3.17 Small Signal Model for Loop Response
      18. 7.3.18 Simple Small Signal Model for Peak Current Mode Control
      19. 7.3.19 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Buck Converter for 7-V to 60-V Input to 5-V at 5-A Output
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design with WEBENCH® Tools
          2. 8.2.1.2.2  Selecting the Switching Frequency
          3. 8.2.1.2.3  Output Inductor Selection (LO)
          4. 8.2.1.2.4  Output Capacitor
          5. 8.2.1.2.5  Catch Diode
          6. 8.2.1.2.6  Input Capacitor
          7. 8.2.1.2.7  Slow Start Capacitor
          8. 8.2.1.2.8  Bootstrap Capacitor Selection
          9. 8.2.1.2.9  Undervoltage Lockout Set Point
          10. 8.2.1.2.10 Output Voltage and Feedback Resistors Selection
          11. 8.2.1.2.11 Compensation
          12. 8.2.1.2.12 Power Dissipation Estimate
          13. 8.2.1.2.13 Safe Operating Area
          14. 8.2.1.2.14 Discontinuous Conduction Mode and Eco-mode Boundary
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Inverting Buck-Boost Topology for Positive Input to Negative Output
      3. 8.2.3 Split-Rail Topology for Positive Input to Negative and Positive Output
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Estimated Circuit Area
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design with WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.2.1.2.12 Power Dissipation Estimate

The following formulas show how to estimate the TPS54561 power dissipation under continuous conduction mode (CCM) operation. These equations should not be used if the device is operating in discontinuous conduction mode (DCM).

The power dissipation of the IC includes conduction loss (PCOND), switching loss (PSW), gate drive loss (PGD) and supply current (PQ). Example calculations are shown with the 12-V typical input voltage of the design example.

Equation 56. GUID-129F517B-DA66-418B-A030-A130E67794AD-low.gif

Equation 57. GUID-D8A78C60-CCD8-4A1A-81C0-F94E5B01841E-low.gif

Equation 58. GUID-F05D4184-ECAC-44C4-B134-CD9E4E3EE1D2-low.gif

Equation 59. GUID-A2E8CD98-EB65-4127-A9C1-6524BD7C2893-low.gif

Where:

IOUT is the output current (A).
RDS(on) is the on-resistance of the high-side MOSFET (Ω).
VOUT is the output voltage (V).
VIN is the input voltage (V).
fsw is the switching frequency (Hz).
trise is the SW pin voltage rise time and can be estimated by trise = VIN x 0.16 ns/V + 3 ns
QG is the total gate charge of the internal MOSFET
IQ is the operating nonswitching supply current

Therefore,

Equation 60. GUID-75CA95A5-928A-4EE4-8D23-57317260B9AA-low.gif

For given TA,

Equation 61. GUID-C5DA8E2B-2C19-464E-B4AE-45065F71CC00-low.gif

For given TJMAX = 150°C

Equation 62. GUID-9B3977DA-B6B3-4770-994E-AA3A8E9B61B7-low.gif

Where:

Ptot is the total device power dissipation (W).
TA is the ambient temperature (°C).
TJ is the junction temperature (°C).
RTH is the thermal resistance from junction to ambient for a given PCB layout (°C/W).
TJMAX is maximum junction temperature (°C).
TAMAX is maximum ambient temperature (°C).

There will be additional power losses in the regulator circuit due to the inductor ac and dc losses, the catch diode and PCB trace resistance impacting the overall efficiency of the regulator.