SLVSC33A August   2013  – October 2022 TPS54625

PRODUCTION DATA  

  1. 1 FEATURES
  2. 2 APPLICATIONS
  3. 3 DESCRIPTION
  4. 4 ORDERING INFORMATION (1)
  5. 5 ABSOLUTE MAXIMUM RATINGS
  6. 6 THERMAL INFORMATION
  7. 7 RECOMMENDED OPERATING CONDITIONS
  8. 8 ELECTRICAL CHARACTERISTICS
  9. 9 DEVICE INFORMATION
  10. 10OVERVIEW
  11. 11DETAILED DESCRIPTION
    1. 11.1 PWM Operation
    2. 11.2 PWM Frequency and Adaptive On-Time Control
    3. 11.3 Soft Start and Pre-Biased Soft Start
    4. 11.4 Power Good
    5. 11.5 Output Discharge Control
    6. 11.6 Current Protection
    7. 11.7 Over/Under Voltage Protection
    8. 11.8 UVLO Protection
    9. 11.9 Thermal Shutdown
  12. 12TYPICAL CHARACTERISTICS
  13. 13DESIGN GUIDE
    1. 13.1 Step By Step Design Procedure
    2. 13.2 Output Voltage Resistors Selection
    3. 13.3 Output Filter Selection
    4. 13.4 Input Capacitor Selection
    5. 13.5 Bootstrap Capacitor Selection
    6. 13.6 VREG5 Capacitor Selection
  14. 14THERMAL INFORMATION
  15. 15LAYOUT CONSIDERATIONS
  16. 16Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 THERMAL INFORMATION

THERMAL METRIC(1) TPS54625 UNITS
PWP (14 PINS)
θJA Junction-to-ambient thermal resistance 40.5 °C/W
θJCtop Junction-to-case (top) thermal resistance 28.7
θJB Junction-to-board thermal resistance 24.2
ψJT Junction-to-top characterization parameter 0.8
ψJB Junction-to-board characterization parameter 23.9
θJCbot Junction-to-case (bottom) thermal resistance 2.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.