SLVSC33A August   2013  – October 2022 TPS54625

PRODUCTION DATA  

  1. 1 FEATURES
  2. 2 APPLICATIONS
  3. 3 DESCRIPTION
  4. 4 ORDERING INFORMATION (1)
  5. 5 ABSOLUTE MAXIMUM RATINGS
  6. 6 THERMAL INFORMATION
  7. 7 RECOMMENDED OPERATING CONDITIONS
  8. 8 ELECTRICAL CHARACTERISTICS
  9. 9 DEVICE INFORMATION
  10. 10OVERVIEW
  11. 11DETAILED DESCRIPTION
    1. 11.1 PWM Operation
    2. 11.2 PWM Frequency and Adaptive On-Time Control
    3. 11.3 Soft Start and Pre-Biased Soft Start
    4. 11.4 Power Good
    5. 11.5 Output Discharge Control
    6. 11.6 Current Protection
    7. 11.7 Over/Under Voltage Protection
    8. 11.8 UVLO Protection
    9. 11.9 Thermal Shutdown
  12. 12TYPICAL CHARACTERISTICS
  13. 13DESIGN GUIDE
    1. 13.1 Step By Step Design Procedure
    2. 13.2 Output Voltage Resistors Selection
    3. 13.3 Output Filter Selection
    4. 13.4 Input Capacitor Selection
    5. 13.5 Bootstrap Capacitor Selection
    6. 13.6 VREG5 Capacitor Selection
  14. 14THERMAL INFORMATION
  15. 15LAYOUT CONSIDERATIONS
  16. 16Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 THERMAL INFORMATION

This PowerPad™ package incorporates an exposed thermal pad that is designed to be directly to an external heatsink. The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC).

For additional information on the PowerPAD™ package and how to use the advantage of its heat dissipating abilities, refer to Technical Brief, PowerPAD™ Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 and Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004.

The exposed thermal pad dimensions for this package are shown in the following illustration.

GUID-BF861E8B-27E8-4889-A228-A0FD207DA362-low.gif Figure 14-1 Thermal Pad Dimensions