SLVSBF3B June   2012  – May 2019 TPS54678

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation and Output Current
      3. 7.3.3  Bootstrap Voltage (Boot) and Low Dropout Operation
      4. 7.3.4  Error Amplifier
      5. 7.3.5  Voltage Reference
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Soft-Start Pin
      9. 7.3.9  Sequencing
      10. 7.3.10 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      11. 7.3.11 Overcurrent Protection
        1. 7.3.11.1 High-Side Overcurrent Protection
        2. 7.3.11.2 Low-Side Overcurrent Protection
      12. 7.3.12 Safe Start-Up into Prebiased Outputs
      13. 7.3.13 Synchronize Using the RT/CLK Pin
      14. 7.3.14 Power Good (PWRGD Pin)
      15. 7.3.15 Overvoltage Transient Protection
      16. 7.3.16 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Small Signal Model for Loop Response
      2. 7.4.2 Simple Small Signal Model for Peak Current Mode Control
      3. 7.4.3 Small Signal Model for Frequency Compensation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Step One: Select the Switching Frequency
        3. 8.2.2.3 Step Two: Select the Output Inductor
        4. 8.2.2.4 Step Three: Choose the Output Capacitor
        5. 8.2.2.5 Step Four: Select the Input Capacitor
        6. 8.2.2.6 Step Five: Choose the Soft-Start Capacitor
        7. 8.2.2.7 Step Six: Select the Bootstrap Capacitor
        8. 8.2.2.8 Step Eight: Select Output Voltage and Feedback Resistors
          1. 8.2.2.8.1 Output Voltage Limitations
        9. 8.2.2.9 Step Nine: Select Loop Compensation Components
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Additional Information About Application Curves
          1. 8.2.3.1.1 Efficiency
          2. 8.2.3.1.2 Voltage Ripple Measurements
          3. 8.2.3.1.3 Start-Up and Shutdown Waveforms
          4. 8.2.3.1.4 Hiccup Mode Current Limit
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation Estimate
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Layout is a critical portion of good power supply design. There are several signal paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance.

  • Minimize the loop area formed by the bypass capacitor connections and the VIN pins. See Figure 48 for a PCB layout example.
  • Tie the GND pins and AGND pin directly to the thermal pad under the TPS54678 device. Connect the thermal pad to any internal PCB ground planes using multiple vias directly under the device. Additional vias can be used to connect the top-side ground area to the internal planes near the input and output capacitors. For operation at full rated load, the top-side ground area along with any additional internal ground planes must provide adequate heat dissipating area.
  • Place the input bypass capacitor as close as possible to the device.
  • Route the PH pin to the output inductor. Because the PH connection is the switching node, place the output inductor close to the PH pins. Minimize the area of the PCB conductor to prevent excessive capacitive coupling.
  • The boot capacitor must also be located close to the device.
  • The sensitive analog ground connections for the feedback voltage divider, compensation components, soft-start capacitor and frequency set resistor must be connected to a separate analog ground trace as shown in Figure 48.
  • The RT/CLK pin is particularly sensitive to noise so the RT resistor should be located as close as possible to the device and routed with minimal trace lengths.
  • The additional external components can be placed approximately as shown. It is possible to obtain acceptable performance with alternate PCB layouts, however, this layout has been shown to produce good results and can be used as a guide.