SLUSF28 November 2023 TPS546A24S
PRODUCTION DATA
Proper mounting technique adequately covers the exposed thermal pad with solder. Excessive heat during the reflow process can affect electrical performance. Figure 7-10 shows the recommended reflow-oven thermal profile. Proper post-assembly cleaning is also critical to device performance. Refer to QFN and SON PCB Attachment application report for more information.
PARAMETER | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
RAMP UP AND RAMP DOWN | |||||
rRAMP(up) | Average ramp-up rate, TS(max) to TP | 3 | °C/s | ||
rRAMP(down) | Average ramp-down rate, TP to TS(max) | 6 | °C/s | ||
PRE-HEAT | |||||
TS | Preheat temperature | 150 | 200 | °C | |
tS | Preheat time, TS(min) to TS(max) | 60 | 180 | s | |
REFLOW | |||||
TL | Liquidus temperature | 217 | °C | ||
TP | Peak temperature | 260 | °C | ||
tL | Time maintained above liquidus temperature, TL | 60 | 150 | s | |
tP | Time maintained within 5°C of peak temperature, TP | 20 | 40 | s | |
t25P | Total time from 25°C to peak temperature, TP | 480 | s |