SLVSDC9B November   2016  – November 2019 TPS54824

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Efficiency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Continuous Conduction Mode Operation (CCM)
      3. 7.3.3  VIN Pins and VIN UVLO
      4. 7.3.4  Voltage Reference and Adjusting the Output Voltage
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Enable and Adjustable UVLO
      7. 7.3.7  Soft Start and Tracking
      8. 7.3.8  Safe Start-up into Pre-Biased Outputs
      9. 7.3.9  Power Good
      10. 7.3.10 Sequencing (SS/TRK)
      11. 7.3.11 Adjustable Switching Frequency (RT Mode)
      12. 7.3.12 Synchronization (CLK Mode)
      13. 7.3.13 Bootstrap Voltage and 100% Duty Cycle Operation (BOOT)
      14. 7.3.14 Output Overvoltage Protection (OVP)
      15. 7.3.15 Overcurrent Protection
        1. 7.3.15.1 High-side MOSFET Overcurrent Protection
        2. 7.3.15.2 Low-side MOSFET Overcurrent Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency
        2. 8.2.2.2  Output Inductor Selection
        3. 8.2.2.3  Output Capacitor
        4. 8.2.2.4  Input Capacitor
        5. 8.2.2.5  Output Voltage Resistors Selection
        6. 8.2.2.6  Soft-start Capacitor Selection
        7. 8.2.2.7  Undervoltage Lockout Set Point
        8. 8.2.2.8  Bootstrap Capacitor Selection
        9. 8.2.2.9  PGOOD Pull-up Resistor
        10. 8.2.2.10 Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Alternate Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS54824 UNIT
RNV
18 PINS
ThetaJA Junction-to-ambient thermal resistance JEDEC 57.1 °C/W
ThetaJA Junction-to-ambient thermal resistance EVM 25 °C/W
ThetaJCtop Junction-to-case (top) thermal resistance 26.3 °C/W
ThetaJB Junction-to-board thermal resistance 18.8 °C/W
PsiJT Junction-to-top characterization parameter 0.8 °C/W
PsiJB Junction-to-board characterization parameter 18.8 °C/W
ThetaJCbot Junction-to-case (bottom) thermal resistance 1.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.