SLUSC70D March   2016  – July 2017 TPS548D22

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 40-A FET
      2. 7.3.2 On-Resistance
      3. 7.3.3 Package Size, Efficiency and Thermal Performance
      4. 7.3.4 Soft-Start Operation
      5. 7.3.5 VDD Supply Undervoltage Lockout (UVLO) Protection
      6. 7.3.6 EN_UVLO Pin Functionality
      7. 7.3.7 Fault Protections
        1. 7.3.7.1 Current Limit (ILIM) Functionality
        2. 7.3.7.2 VDD Undervoltage Lockout (UVLO)
        3. 7.3.7.3 Overvoltage Protection (OVP) and Undervoltage Protection (UVP)
        4. 7.3.7.4 Out-of-Bounds Operation
        5. 7.3.7.5 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 DCAP3 Control Topology
      2. 7.4.2 DCAP Control Topology
    5. 7.5 Programming
      1. 7.5.1 Programmable Pin-Strap Settings
        1. 7.5.1.1 Frequency Selection (FSEL) Pin
        2. 7.5.1.2 VSEL Pin
        3. 7.5.1.3 DCAP3 Control and Mode Selection
          1. 7.5.1.3.1 Application Workaround to Support 4-ms and 8-ms SS Settings
      2. 7.5.2 Programmable Analog Configurations
        1. 7.5.2.1 RSP/RSN Remote Sensing Functionality
          1. 7.5.2.1.1 Output Differential Remote Sensing Amplifier
        2. 7.5.2.2 Power Good (PGOOD Pin) Functionality
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS548D22 1.5-V to 16-V Input, 1-V Output, 40-A Converter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Design Procedure
        1. 8.2.3.1  Switching Frequency Selection
        2. 8.2.3.2  Inductor Selection
        3. 8.2.3.3  Output Capacitor Selection
          1. 8.2.3.3.1 Minimum Output Capacitance to Ensure Stability
          2. 8.2.3.3.2 Response to a Load Transient
          3. 8.2.3.3.3 Output Voltage Ripple
        4. 8.2.3.4  Input Capacitor Selection
        5. 8.2.3.5  Bootstrap Capacitor Selection
        6. 8.2.3.6  BP Pin
        7. 8.2.3.7  R-C Snubber and VIN Pin High-Frequency Bypass
        8. 8.2.3.8  Optimize Reference Voltage (VSEL)
        9. 8.2.3.9  MODE Pin Selection
        10. 8.2.3.10 Overcurrent Limit Design.
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Mounting and Thermal Profile Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
Input voltage PVIN –0.3 25 V
VDD –0.3 25
BOOT –0.3 34
BOOT to SW DC –0.3 7.7
< 10 ns –0.3 9.0
NU –0.3 6
EN_UVLO, VOSNS, MODE, FSEL, ILIM –0.3 7.7
RSP, RESV_TRK, VSEL –0.3 3.6
RSN –0.3 0.3
PGND, AGND, DRGND –0.3 0.3
SW DC –0.3 25
< 10 ns –5 27
Output voltage PGOOD, BP –0.3 7.7 V
Junction temperature, TJ –55 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.