SLUSCI9A August   2016  – September 2017 TPS549D22

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 40-A FET
      2. 7.3.2 On-Resistance
      3. 7.3.3 Package Size, Efficiency and Thermal Performance
      4. 7.3.4 Soft-Start Operation
      5. 7.3.5 VDD Supply Undervoltage Lockout (UVLO) Protection
      6. 7.3.6 EN_UVLO Pin Functionality
      7. 7.3.7 Fault Protections
        1. 7.3.7.1 Current Limit (ILIM) Functionality
        2. 7.3.7.2 VDD Undervoltage Lockout (UVLO)
        3. 7.3.7.3 Overvoltage Protection (OVP) and Undervoltage Protection (UVP)
        4. 7.3.7.4 Out-of-Bounds Operation
        5. 7.3.7.5 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 DCAP3 Control Topology
      2. 7.4.2 DCAP Control Topology
    5. 7.5 Programming
      1. 7.5.1 Programmable Pin-Strap Settings
        1. 7.5.1.1 Address Selection (ADDR) Pin
        2. 7.5.1.2 VSEL Pin
        3. 7.5.1.3 DCAP3 Control and Mode Selection
        4. 7.5.1.4 Application Workaround to Support 4-ms and 8-ms SS Settings
      2. 7.5.2 Programmable Analog Configurations
        1. 7.5.2.1 RSP/RSN Remote Sensing Functionality
          1. 7.5.2.1.1 Output Differential Remote Sensing Amplifier
        2. 7.5.2.2 Power Good (PGOOD Pin) Functionality
      3. 7.5.3 PMBus Programming
        1. 7.5.3.1 TPS549D22 Limitations to the PMBUS Specifications
        2. 7.5.3.2 Slave Address Assignment
        3. 7.5.3.3 PMBUS Address Selection
        4. 7.5.3.4 Supported Formats
          1. 7.5.3.4.1 Direct Format — Write
          2. 7.5.3.4.2 Combined Format — Read
        5. 7.5.3.5 Stop Separated Reads
        6. 7.5.3.6 Supported PMBUS Commands and Registers
      4. 7.5.4 Register Maps
        1. 7.5.4.1  OPERATION Register (address = 1h)
        2. 7.5.4.2  ON_OFF_CONFIG Register (address = 2h)
        3. 7.5.4.3  CLEAR FAULTS (address = 3h)
        4. 7.5.4.4  WRITE PROTECT (address = 10h)
        5. 7.5.4.5  STORE_DEFAULT_ALL (address = 11h)
        6. 7.5.4.6  RESTORE_DEFAULT_ALL (address = 12h)
        7. 7.5.4.7  CAPABILITY (address = 19h)
        8. 7.5.4.8  VOUT_MODE (address = 20h)
        9. 7.5.4.9  VOUT_COMMAND (address = 21h)
        10. 7.5.4.10 VOUT_MARGIN_HIGH (address = 25h)
        11. 7.5.4.11 VOUT_MARGIN_LOW (address = 26h)
        12. 7.5.4.12 STATUS_BYTE (address = 78h)
        13. 7.5.4.13 STATUS_WORD (High Byte) (address = 79h)
        14. 7.5.4.14 STATUS_VOUT (address = 7Ah)
        15. 7.5.4.15 STATUS_IOUT (address = 7Bh)
        16. 7.5.4.16 STATUS_CML (address = 7Eh)
        17. 7.5.4.17 MFR_SPECIFIC_00 (address = D0h)
        18. 7.5.4.18 MFR_SPECIFIC_01 (address = D1h)
        19. 7.5.4.19 MFR_SPECIFIC_02 (address = D2h)
        20. 7.5.4.20 MFR_SPECIFIC_03 (address = D3h)
        21. 7.5.4.21 MFR_SPECIFIC_04 (address = D4h)
        22. 7.5.4.22 MFR_SPECIFIC_06 (address = D6h)
        23. 7.5.4.23 MFR_SPECIFIC_07 (address = D7h)
        24. 7.5.4.24 MFR_SPECIFIC_44 (address = FCh)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application: TPS549D22 1.5-V to 16-V Input, 1-V Output, 40-A Converter
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Switching Frequency Selection
        3. 8.2.2.3  Inductor Selection
        4. 8.2.2.4  Output Capacitor Selection
          1. 8.2.2.4.1 Minimum Output Capacitance to Ensure Stability
          2. 8.2.2.4.2 Response to a Load Transient
          3. 8.2.2.4.3 Output Voltage Ripple
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  Bootstrap Capacitor Selection
        7. 8.2.2.7  BP Pin
        8. 8.2.2.8  R-C Snubber and VIN Pin High-Frequency Bypass
        9. 8.2.2.9  Optimize Reference Voltage (VSEL)
        10. 8.2.2.10 MODE Pin Selection
        11. 8.2.2.11 ADDR Pin Selection
        12. 8.2.2.12 Overcurrent Limit Design
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Mounting and Thermal Profile Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Custom Design With WEBENCH® Tools
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 13Package Option Addendum
    1. 13.1 Packaging Information
    2. 13.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RVF|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Package Option Addendum

13.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish(3) MSL Peak Temp (4) Op Temp (°C) Device Marking(5)(6)
TPS549D22RVFR ACTIVE LQFN-CLIP RVF 40 2500 Pb-Free (RoHS Exempt) CU NIPDAU Level-2-260C-1 YEAR –40 to 125 TPS549D22
TPS549D22RVFT ACTIVE LQFN-CLIP RVF 40 250 Pb-Free (RoHS Exempt) CU NIPDAU Level-2-260C-1 YEAR –40 to 125 TPS549D22
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
space
(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
space
(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(6) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

13.2 Tape and Reel Information

TPS549D22 Tape_and_Reel_Dims.gif
Device Package
Type		 Package Drawing Pins SPQ Reel
Diameter (mm)		 Reel
Width W1 (mm)		 A0
(mm)		 B0
(mm)		 K0
(mm)		 P1
(mm)		 W
(mm)		 Pin1
Quadrant
TPS549D22RVFR LQFN-CLIP RVF 40 2500 330.0 16.4 5.35 7.35 1.7 8.0 16.0 Q3
TPS549D22RVFT LQFN-CLIP RVF 40 250 178.0 16.4 5.35 7.35 1.7 8.0 16.0 Q3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS549D22RVFR LQFN-CLIP RVF 40 2500 367.0 367.0 38.0
TPS549D22RVFT LQFN-CLIP RVF 40 250 210.0 185.0 35.0