SLVSAV0B April 2011 – October 2014 TPS55010
PRODUCTION DATA.
Name | Number | Description |
---|---|---|
VIN | 1, 2, 16 | Supplies the control circuitry and switches of the power converter. |
GND | 3, 4, 5 | Power Ground. This pin should be electrically connected directly to the thermal pad under the IC. |
VSENSE | 6 | Inverting node of the transconductance error amplifier. |
COMP | 7 | Error amplifier output, and input to the output switch current comparator. Connect frequency compensation components to this pin. |
RT/CLK | 8 | Resistor Timing and External Clock. An internal amplifier holds this pin at a fixed voltage when using an external resistor to ground to set the switching frequency. If the pin is pulled above the PLL upper threshold, a mode change occurs and the pin becomes a synchronization input. The internal amplifier is disabled and the pin is a high impedance clock input to the internal PLL. If clocking edges stop, the internal amplifier is re-enabled and the mode returns to a resistor set function. |
SS | 9 | Slow-start. An external capacitor connected to this pin sets the output rise time. |
PH | 10, 11, 12 | The source of the internal high side power MOSFET, and drain of the internal low side MOSFET. |
BOOT | 13 | A bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor is below the minimum required by the output device, the output is forced to switch off until the capacitor is refreshed. |
FAULT | 14 | An open drain output. Active low if the output voltage is low due to thermal shutdown, dropout, overvoltage or EN shut down. |
EN | 15 | Enable pin, internal pull-up current source. Pull below 1.2V to disable. Float to enable. Adjust the input undervoltage lockout with two resistors. |
THERMAL PAD | 17 | GND pin should be connected to the exposed thermal pad for proper operation. This thermal pad should be connected to any internal PCB ground plane using multiple vias for good thermal performance. |