SLVSD46A November   2017  – December 2021 TPS55160-Q1 , TPS55162-Q1 , TPS55165-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics — External Components
    6. 7.6  Electrical Characteristics — Supply Voltage (VINP, VINL pins)
    7. 7.7  Electrical Characteristics — Reference Voltage (VOS_FB Pin) and Output Voltage (VOUT Pin)
    8. 7.8  Electrical Characteristics — Buck-Boost
    9. 7.9  Electrical Characteristics — Undervoltage and Overvoltage Lockout
    10. 7.10 Electrical Characteristics — IGN Wakeup
    11. 7.11 Electrical Characteristics — Logic Pins PS, IGN_PWRL, SS_EN
    12. 7.12 Electrical Characteristics – Overtemperature Protection
    13. 7.13 Electrical Characteristics – Power Good
    14. 7.14 Switching Characteristics — Reference Voltage (VOS_FB Pin) and Output Voltage (VOUT Pin)
    15. 7.15 Switching Characteristics — Buck-Boost
    16. 7.16 Switching Characteristics — Undervoltage and Overvoltage Lockout
    17. 7.17 Switching Characteristics — IGN Wakeup
    18. 7.18 Switching Characteristics — Logic Pins PS, IGN_PWRL, SS_EN
    19. 7.19 Switching Characteristics – Power Good
    20. 7.20 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spread-Spectrum Feature
      2. 8.3.2 Overcurrent Protection
      3. 8.3.3 Overtemperature Protection
      4. 8.3.4 Undervoltage Lockout and Minimum Start-Up Voltage
      5. 8.3.5 Overvoltage Lockout
      6. 8.3.6 VOUT Overvoltage Protection
      7. 8.3.7 Power-Good Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 State Diagram
      2. 8.4.2 Modes of Operation
        1. 8.4.2.1 Normal Mode
        2. 8.4.2.2 Low-Power Mode
      3. 8.4.3 Power-Up and Power-Down Sequences
      4. 8.4.4 Soft-Start Feature
      5. 8.4.5 Pulldown Resistor on VOUT
      6. 8.4.6 Output Voltage Selection
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Application Circuits for Output Voltage Configurations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power-Circuit Selections: CIN, L, COUT
          1. 9.2.2.1.1 Inductor Current in Step-Down Mode
          2. 9.2.2.1.2 Inductor Current in Step-Up Mode
          3. 9.2.2.1.3 Inductor Current in Buck-Boost Overlap Mode
          4. 9.2.2.1.4 Inductor Peak Current
        2. 9.2.2.2 Control-Circuit Selections
          1. 9.2.2.2.1 Bootstrap Capacitors
          2. 9.2.2.2.2 VOUT-Sense Bypass Capacitor
          3. 9.2.2.2.3 VREG Bypass Capacitor
          4. 9.2.2.2.4 PG Pullup Resistor and Delay Time
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.1 Power-Circuit Selections: CIN, L, COUT

The TPS5516x-Q1 family of devices integrates not only the power switches but also the loop compensation network as well as many other control circuits which reduces the number of required external components. For the internal loop compensation to be effective, the selection of the external power circuits (power inductor and capacitor) must be confined. TI strongly recommends users selecting the component values as follows: 3.3-µH to 6.2-µH power inductor, 18-µF to 47-µF output capacitor, and 8.2-µF or greater input capacitor. Because the TPS5516x-Q1 device switches at about 2 MHz, a shielded inductor and X5R-type or X7R-type ceramic capacitors should be used for the power circuit.

Considering the component tolerance, the following power component values were selected for this design example:

  • CIN = 20 µF
  • COUT = 22 µF
  • L = 4.7 µH

For the input capacitor (CIN), the voltage rating should be greater than the maximum input voltage (VIN_MAX). Therefore, two, 10-µF X7R capacitors rated for 50 V were selected for this design example. Adding a small, high-frequency decoupling ceramic capacitor (CVINP with a value of 100 nF typical) in parallel with the input capacitor is recommended to better filter out the switching noises at the VINP pin. Adding another decoupling ceramic capacitor (CVINL with a value of 470 nF typical) is also recommended for the VINL pin.

The output capacitor (COUT), receives a voltage of 5 V. Considering some voltage-rating margin, two 10-µF X7R capacitors rater for 10 V or greater and one, 2.2-µF X7R-type capacitor rated for 10 V or greater in parallel were selected for the output capacitor. Adding a small, high-frequency decoupling ceramic capacitor (CVOSN with a value of 100 nF typical) in parallel with the output capacitor is recommended to better filter out the switching noises at the VOUT_SENSE pin.

The power inductor (L) should be a shielded type, and it should not saturate during operation. The inductor should also be able to support the power dissipation under the maximum load. Use the calculations in the following sections to find the required current capabilities for the inductor.