SLVSHR3 July   2024 TPS551892-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  VCC Power Supply
      2. 6.3.2  EXTVCC Power Supply
      3. 6.3.3  Input Undervoltage Lockout
      4. 6.3.4  Enable and Programmable UVLO
      5. 6.3.5  Soft Start
      6. 6.3.6  Shutdown
      7. 6.3.7  Switching Frequency
      8. 6.3.8  Switching Frequency Dithering
      9. 6.3.9  Inductor Current Limit
      10. 6.3.10 Internal Charge Path
      11. 6.3.11 Output Voltage Setting
      12. 6.3.12 Output Current Monitoring and Cable Voltage Droop Compensation
      13. 6.3.13 Output Current Limit
      14. 6.3.14 Overvoltage Protection
      15. 6.3.15 Output Short Circuit Protection
      16. 6.3.16 Power Good
      17. 6.3.17 Constant Current Output Indication
      18. 6.3.18 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Power Save Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Switching Frequency
        2. 7.2.2.2 Output Voltage Setting
        3. 7.2.2.3 Inductor Selection
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Output Current Limit
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TPS551892-Q1 21-pin VQFN-HR, RYQ Package (Transparent Top View)Figure 4-1 21-pin VQFN-HR, RYQ Package (Transparent Top View)
Table 4-1 Pin Functions
PINI/ODESCRIPTION
NO.NAME
1EN/UVLOIEnable logic input and programmable input voltage undervoltage lockout (UVLO) input. Logic high level enables the device. Logic low level disables the device and turns it into shutdown mode. After the voltage at the EN/UVLO pin is above the logic high voltage of 1.15 V, this pin acts as programmable UVLO input with 1.23-V internal reference.
2MODEIMode selection pin in light load condition. When it is connected to logic high voltage, the device works in forced PWM mode. When it is connected to logic low voltage, the device works in auto PFM mode. This pin can not be float in application.
3PGOPower good indication open drain output. When the output voltage is above 95% of the setting output voltage, this pin outputs high impedance. When the output voltage is below 90% of the setting output voltage, this pin outputs low level
4CCOConstant current output indication open drain output. When output current limit is triggered, this pin outputs low level.
5DITH/SYNCIDithering frequency setting and synchronous clock input. Use a capacitor between this pin and ground to set the dithering frequency. When this pin is short to ground or pulled above 1.2 V, there is no dithering function. An external clock can be applied at this pin to synchronize the switching frequency.
6FSW

I

The switching frequency is programmed by a resistor between this pin and the AGND pin.
7VINPWRInput of the buck-boost converter.
8SW1PWRThe switching node pin of the buck side. It is connected to the drain of the internal buck low-side power MOSFET and the source of internal buck high-side power MOSFET.
9PGNDPWRPower ground of the IC.
10SW2PWRThe switching node pin of the boost side. It is connected to the drain of the internal boost low-side power MOSFET and the source of internal boost high-side power MOSFET.
11VOUTPWROutput of the buck-boost converter.
12ISPIPositive input of the current sense amplifier. An optional current sense resistor connected between the ISP pin and the ISN pin can limit the output current. If the sensed voltage reaches the current limit, a slow constant current control loop becomes active and starts to regulate the voltage between the ISP pin and the ISN pin. Connecting the ISP pin and the ISN pin together with the VOUT pin can disable the output current limit function.
13ISNINegative input of the current sense amplifier. An optional current sense resistor connected between the ISP pin and the ISN pin can limit the output current. If the sensed voltage reaches the current limit, a slow constant current control loop becomes active and starts to regulate the voltage between the ISP pin and the ISN pin. Connecting the ISP pin and the ISN pin together with the VOUT pin can disable the output current limit function.
14FBI Connect to the center of a resistor divider to program the output voltage
15COMPOOutput of the internal error amplifier. Connect the loop compensation network between this pin and the AGND pin.
16CDCOVoltage output proportional to the sensed voltage between the ISP pin and the ISN pin. Use a resistor between this pin and AGND to increase the output voltage to compensate voltage droop across the cable caused by the cable resistance.
17AGND

-

Signal ground of the IC.
18VCCOOutput of the internal regulator. A ceramic capacitor of more than 4.7 μF is required between this pin and the AGND pin.
19BOOT2OPower supply for high-side MOSFET gate driver in boost side. A ceramic capacitor of 0.1 µF must be connected between this pin and the SW2 pin.
20BOOT1OPower supply for high-side MOSFET gate driver in buck side. A ceramic capacitor of 0.1 µF must be connected between this pin and the SW1 pin.
21EXTVCCISelect the internal LDO or external 5V for VCC. When it is connected to logic high voltage or is left floating, select the internal LDO. When it is connected to logic low voltage, select the external 5V for VCC.