SLVSGW6 August   2024 TPS55287

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  VCC Power Supply
      2. 6.3.2  EXTVCC Power Supply
      3. 6.3.3  Operation Mode Setting
      4. 6.3.4  Input Undervoltage Lockout
      5. 6.3.5  Enable and Programmable UVLO
      6. 6.3.6  Soft Start
      7. 6.3.7  Shutdown and Load Discharge
      8. 6.3.8  Switching Frequency
      9. 6.3.9  Switching Frequency Dithering
      10. 6.3.10 Inductor Current Limit
      11. 6.3.11 Internal Charge Path
      12. 6.3.12 Output Voltage Setting
      13. 6.3.13 Output Current Monitoring and Cable Voltage Droop Compensation
      14. 6.3.14 Output Current Limit
      15. 6.3.15 Overvoltage Protection
      16. 6.3.16 Output Short Circuit Protection
      17. 6.3.17 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Power Save Mode
    5. 6.5 Programming
      1. 6.5.1 Data Validity
      2. 6.5.2 START and STOP Conditions
      3. 6.5.3 Byte Format
      4. 6.5.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      5. 6.5.5 Target Address and Data Direction Bit
      6. 6.5.6 Single Read and Write
      7. 6.5.7 Multiread and Multiwrite
    6. 6.6 Register Maps
      1. 6.6.1 REF Register (Address = 0h, 1h)
      2. 6.6.2 IOUT_LIMIT Register (Address = 2h) [reset = 11100100h]
      3. 6.6.3 VOUT_SR Register (Address = 3h) [reset = 00000001h]
      4. 6.6.4 VOUT_FS Register (Address = 4h) [reset = 00000011h]
      5. 6.6.5 CDC Register (Address = 5h) [reset = 11100000h]
      6. 6.6.6 MODE Register (Address = 6h) [reset = 00100000h]
      7. 6.6.7 STATUS Register (Address = 7h) [reset = 00000011h]
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Switching Frequency
        2. 7.2.2.2 Output Voltage Setting
        3. 7.2.2.3 Inductor Selection
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Output Current Limit
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TPS55287 21-Pin VQFN-HR RYQ Package (Transparent Top View)Figure 4-1 21-Pin VQFN-HR RYQ Package (Transparent Top View)
Table 4-1 Pin Functions
PinI/ODescription
NameNO.
EN/UVLO1IEnable logic input and programmable input voltage undervoltage lockout (UVLO) input. Logic high level enables the device. Logic low level disables the device and turns it into shutdown mode. After the voltage at the EN/UVLO pin is above the logic high voltage of 1.15 V, this pin acts as programmable UVLO input with 1.23-V internal reference.
MODE2II2C target address selection. When it is connected to the logic high voltage, the I2C target address is 74H. When it is connected to the logic low voltage, the I2C target address is 75H.
SCL3IClock of I2C interface
SDA4I/OData of I2C interface
DITH/SYNC5IDithering frequency setting and synchronous clock input. Use a capacitor between this pin and ground to set the dithering frequency. When this pin is short to ground or pulled above 1.2 V, there is no dithering function. An external clock can be applied at this pin to synchronize the switching frequency.
FSW6IThe switching frequency is programmed by a resistor between this pin and the AGND pin.
VIN7PWRInput of the buck-boost converter
SW18PWRThe switching node pin of the buck side. It is connected to the drain of the internal buck low-side power MOSFET and the source of internal buck high-side power MOSFET.
PGND9PWRPower ground of the IC
SW210PWRThe switching node pin of the boost side. It is connected to the drain of the internal boost low-side power MOSFET and the source of internal boost high-side power MOSFET.
VOUT11PWROutput of the buck-boost converter
ISP12IPositive input of the current sense amplifier. An optional current sense resistor connected between the ISP pin and the ISN pin can limit the output current. If the sensed voltage reaches the current limit setting value in the register, a slow constant current control loop becomes active and starts to regulate the voltage between the ISP pin and the ISN pin. Connecting the ISP pin and the ISN pin together with the VOUT pin can disable the output current limit function.
ISN13INegative input of the current sense amplifier. An optional current sense resistor connected between the ISP pin and the ISN pin can limit the output current. If the sensed voltage reaches the current limit setting value in the register, a slow constant current control loop becomes active and starts to regulate the voltage between the ISP pin and the ISN pin. Connecting the ISP pin and the ISN pin together with the VOUT pin can disable the output current limit function.
FB/INT14I/OWhen the device is set to use external output voltage feedback, connect to the center tap of a resistor divider to program the output voltage. When the device is set to use internal feedback, this pin is a fault indicator output. When there is an internal fault happening, this pin outputs logic low level.
COMP15OOutput of the internal error amplifier. Connect the loop compensation network between this pin and the AGND pin.
CDC16OVoltage output proportional to the sensed voltage between the ISP pin and the ISN pin. Use a resistor between this pin and AGND to increase the output voltage to compensate voltage droop across the cable caused by the cable resistance.
AGND17—Signal ground of the IC
VCC18OOutput of the internal regulator. A ceramic capacitor of more than 4.7 μF is required between this pin and the AGND pin.
BOOT219OPower supply for high-side MOSFET gate driver in boost side. A 0.1-µF ceramic capacitor must be connected between this pin and the SW2 pin.
BOOT120OPower supply for high-side MOSFET gate driver in buck side. A 0.1-µF ceramic capacitor must be connected between this pin and the SW1 pin.
EXTVCC21ISelect the internal LDO or external 5 V for VCC. When it is connected to logic high voltage, select the internal LDO. When it is connected to logic low voltage, select the external 5 V for VCC.