SLVSGW6 August   2024 TPS55287

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  VCC Power Supply
      2. 6.3.2  EXTVCC Power Supply
      3. 6.3.3  Operation Mode Setting
      4. 6.3.4  Input Undervoltage Lockout
      5. 6.3.5  Enable and Programmable UVLO
      6. 6.3.6  Soft Start
      7. 6.3.7  Shutdown and Load Discharge
      8. 6.3.8  Switching Frequency
      9. 6.3.9  Switching Frequency Dithering
      10. 6.3.10 Inductor Current Limit
      11. 6.3.11 Internal Charge Path
      12. 6.3.12 Output Voltage Setting
      13. 6.3.13 Output Current Monitoring and Cable Voltage Droop Compensation
      14. 6.3.14 Output Current Limit
      15. 6.3.15 Overvoltage Protection
      16. 6.3.16 Output Short Circuit Protection
      17. 6.3.17 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Power Save Mode
    5. 6.5 Programming
      1. 6.5.1 Data Validity
      2. 6.5.2 START and STOP Conditions
      3. 6.5.3 Byte Format
      4. 6.5.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      5. 6.5.5 Target Address and Data Direction Bit
      6. 6.5.6 Single Read and Write
      7. 6.5.7 Multiread and Multiwrite
    6. 6.6 Register Maps
      1. 6.6.1 REF Register (Address = 0h, 1h)
      2. 6.6.2 IOUT_LIMIT Register (Address = 2h) [reset = 11100100h]
      3. 6.6.3 VOUT_SR Register (Address = 3h) [reset = 00000001h]
      4. 6.6.4 VOUT_FS Register (Address = 4h) [reset = 00000011h]
      5. 6.6.5 CDC Register (Address = 5h) [reset = 11100000h]
      6. 6.6.6 MODE Register (Address = 6h) [reset = 00100000h]
      7. 6.6.7 STATUS Register (Address = 7h) [reset = 00000011h]
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Switching Frequency
        2. 7.2.2.2 Output Voltage Setting
        3. 7.2.2.3 Inductor Selection
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Output Current Limit
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Layout Guidelines

As for all switching power supplies, especially those running at high switching frequency and high currents, layout is an important design step. If layout is not carefully done, the regulator can suffer from instability and noise problems.

  • Place the 0.1-μF small package (0402) ceramic capacitors close to the VIN/VOUT pins to minimize high frequency current loops. This improves the radiation of high-frequency noise (EMI) and efficiency.
  • Use multiple GND vias near PGND pin to connect the PGND to the internal ground plane. This also improves thermal performance.
  • Minimize the SW1 and SW2 loop areas as these are high dv/dt nodes. Use a ground plane under the switching regulator to minimize interplane coupling.
  • Use Kelvin connections to RSENSE for the current sense signals ISP and ISN and run lines in parallel from the RSENSE terminals to the IC pins. Place the filter capacitor for the current sense signal as close to the IC pins as possible.
  • Place the BOOT1 bootstrap capacitor close to the IC and connect directly to the BOOT1 to SW1 pins. Place the BOOT2 bootstrap capacitor close to the IC and connect directly to the BOOT2 and SW2 pins.
  • Place the VCC capacitor close to the IC with wide and short trace. The GND terminal of the VCC capacitor should be directly connected with PGND plane through three to four vias.
  • Isolate the power ground from the analog ground. The PGND plane and AGND plane are connected at the terminal of the VCC capacitor. Thus the noise caused by the MOSFET driver and parasitic inductance does not interface with the AGND and internal control circuit.
  • Place the compensation components as close to the COMP pin as possible. Keep the compensation components, feedback components, and other sensitive analog circuitry far away from the power components, switching nodes SW1 and SW2, and high-current trace to prevent noise coupling into the analog signals.
  • To improve thermal performance, it is recommended to use thermal vias beneath the TPS55287 connecting the VIN pin to a large VIN area, and the VOUT pin to a large VOUT area separately.