SLVSGW6 August   2024 TPS55287

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  VCC Power Supply
      2. 6.3.2  EXTVCC Power Supply
      3. 6.3.3  Operation Mode Setting
      4. 6.3.4  Input Undervoltage Lockout
      5. 6.3.5  Enable and Programmable UVLO
      6. 6.3.6  Soft Start
      7. 6.3.7  Shutdown and Load Discharge
      8. 6.3.8  Switching Frequency
      9. 6.3.9  Switching Frequency Dithering
      10. 6.3.10 Inductor Current Limit
      11. 6.3.11 Internal Charge Path
      12. 6.3.12 Output Voltage Setting
      13. 6.3.13 Output Current Monitoring and Cable Voltage Droop Compensation
      14. 6.3.14 Output Current Limit
      15. 6.3.15 Overvoltage Protection
      16. 6.3.16 Output Short Circuit Protection
      17. 6.3.17 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Power Save Mode
    5. 6.5 Programming
      1. 6.5.1 Data Validity
      2. 6.5.2 START and STOP Conditions
      3. 6.5.3 Byte Format
      4. 6.5.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      5. 6.5.5 Target Address and Data Direction Bit
      6. 6.5.6 Single Read and Write
      7. 6.5.7 Multiread and Multiwrite
    6. 6.6 Register Maps
      1. 6.6.1 REF Register (Address = 0h, 1h)
      2. 6.6.2 IOUT_LIMIT Register (Address = 2h) [reset = 11100100h]
      3. 6.6.3 VOUT_SR Register (Address = 3h) [reset = 00000001h]
      4. 6.6.4 VOUT_FS Register (Address = 4h) [reset = 00000011h]
      5. 6.6.5 CDC Register (Address = 5h) [reset = 11100000h]
      6. 6.6.6 MODE Register (Address = 6h) [reset = 00100000h]
      7. 6.6.7 STATUS Register (Address = 7h) [reset = 00000011h]
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Switching Frequency
        2. 7.2.2.2 Output Voltage Setting
        3. 7.2.2.3 Inductor Selection
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Output Current Limit
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM),  per AEC Q100-002(1) ±2000 V
Charged device model (CDM), per AEC Q100-011, all pins(2) ±500
(1) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.