SLVSFQ8A December   2020  – December 2021 TPS552882-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VCC Power Supply
      2. 7.3.2  Operation Mode Setting
      3. 7.3.3  Input Undervoltage Lockout
      4. 7.3.4  Enable and Programmable UVLO
      5. 7.3.5  Soft Start
      6. 7.3.6  Shutdown
      7. 7.3.7  Switching Frequency
      8. 7.3.8  Switching Frequency Dithering
      9. 7.3.9  Inductor Current Limit
      10. 7.3.10 Internal Charge Path
      11. 7.3.11 Output Voltage Setting
      12. 7.3.12 Output Current Indication and Cable Voltage Drop Compensation
      13. 7.3.13 Integrated Gate Drivers
      14. 7.3.14 Output Current Limit
      15. 7.3.15 Overvoltage Protection
      16. 7.3.16 Output Short Circuit Protection
      17. 7.3.17 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 Power Save Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Switching Frequency
        3. 8.2.2.3 Output Voltage Setting
        4. 8.2.2.4 Inductor Selection
        5. 8.2.2.5 Input Capacitor
        6. 8.2.2.6 Output Capacitor
        7. 8.2.2.7 Output Current Limit Sense Resistor
        8. 8.2.2.8 Loop Stability
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Glossary
    6. 11.6 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS552882-Q1TPS552882-Q1UNIT
VQFN-HR (RPM)-26 PINSVQFN-HR (RPM)-26 PINS
StandardEVM(2)
RθJAJunction-to-ambient thermal resistance47.525.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance23.8N/A°C/W
RθJBJunction-to-board thermal resistance12.8N/A°C/W
ΨJTJunction-to-top characterization parameter0.50.6°C/W
ΨJBJunction-to-board characterization parameter12.711.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance7.8N/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Simulated on TPS552882-Q1EVM-045, 4-layer, 2-oz/2-oz/2-oz/2-oz copper 112-mm×71-mm PCB.