SLVSBX8B May   2013  – January 2019 TPS55330

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application (Boost)
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operation
      2. 7.3.2 Switching Frequency
      3. 7.3.3 Overcurrent Protection and Frequency Foldback
        1. 7.3.3.1 Minimum On-Time and Pulse Skipping
      4. 7.3.4 Voltage Reference and Setting Output Voltage
      5. 7.3.5 Soft-Start
      6. 7.3.6 Slope Compensation
      7. 7.3.7 Enable and Thermal Shutdown
      8. 7.3.8 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VI < 2.9 V (Minimum VI)
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Operation at Light Loads
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Selecting the Switching Frequency (R4)
        3. 8.2.2.3  Determining the Duty Cycle
        4. 8.2.2.4  Selecting the Inductor (L1)
        5. 8.2.2.5  Computing the Maximum Output Current
        6. 8.2.2.6  Selecting the Output Capacitor (C8-C10)
        7. 8.2.2.7  Selecting the Input Capacitors (C2, C7)
        8. 8.2.2.8  Setting Output Voltage (R1, R2)
        9. 8.2.2.9  Setting the Soft-start Time (C7)
        10. 8.2.2.10 Selecting the Schottky Diode (D1)
        11. 8.2.2.11 Compensating the Control Loop (R3, C4, C5)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

16-Pin RTE
QFN Package
Top View
TPS55330 po_lvsbd4.gif
TI recommends connecting NC with AGND.

Pin Functions

PIN DESCRIPTION
NAME NUMBER
VIN 2 The input supply pin to the IC. Connect VIN to a supply voltage between 2.9 V and 16 V. It is acceptable for the voltage on the pin to be different from the boost power stage input.
SW 1, 15, 16 SW is the drain of the internal power MOSFET. Connect SW to the switched side of the boost or SEPIC inductor or the flyback transformer.
FB 8 Error amplifier input and feedback pin for positive voltage regulation. Connect to the center tap of a resistor divider to program the output voltage.
EN 3 Enable pin. When the voltage of this pin falls below the enable threshold for more than 1 ms, the IC turns off.
COMP 7 Output of the transconductance error amplifier. An external RC network connected to this pin compensates the regulator feedback loop.
SS 4 Soft-start programming pin. A capacitor between the SS pin and AGND pin programs soft-start timing.
FREQ 9 Switching frequency program pin. An external resistor connected between the FREQ pin and AGND sets the switching frequency.
AGND 6 Signal ground of the IC.
PGND 11, 12, 13 Power ground of the IC. It is connected to the source of the internal power MOSFET switch.
SYNC 5 Switching frequency synchronization pin. An external clock signal can be used to set the switching frequency between 200 kHz and 1 MHz. If not used, this pin should be tied to AGND.
NC 10, 14 Reserved pin that must be connected to ground.
PowerPAD 17 Solder the PowerPAD to the AGND. If possible, use thermal vias to connect to internal ground plane for improved power dissipation.