SLVSCG7A July 2014 – September 2021 TPS55340-EP
PRODUCTION DATA
The maximum IC junction temperature should be restricted to 150°C under normal operating conditions. This restriction limits the power dissipation of the TPS55340-EP. The TPS55340-EP features a thermally enhanced WQFN package. This package includes a PowerPAD that improves the thermal capabilities of the package. The thermal resistance of the WQFN package in any application greatly depends on the PCB layout and the PowerPAD connection. The PowerPAD must be soldered to the analog ground on the PCB. Use thermal vias underneath the PowerPAD to achieve good thermal performance.