SLVSCG7A July   2014  – September 2021 TPS55340-EP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Switching Frequency
      2. 8.3.2  Voltage Reference and Setting Output Voltage
      3. 8.3.3  Soft Start
      4. 8.3.4  Slope Compensation
      5. 8.3.5  Overcurrent Protection and Frequency Foldback
      6. 8.3.6  Enable and Thermal Shutdown
      7. 8.3.7  Undervoltage Lockout (UVLO)
      8. 8.3.8  Minimum On-Time and Pulse Skipping
      9. 8.3.9  Layout Considerations
      10. 8.3.10 Thermal Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation With VIN < 2.9 V (Minimum VIN)
      2. 8.4.2 Synchronization
      3. 8.4.3 Oscillator
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Boost Converter Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Selecting the Switching Frequency (R4)
          2. 9.2.1.2.2  Determining the Duty Cycle
          3. 9.2.1.2.3  Selecting the Inductor (L1)
          4. 9.2.1.2.4  Computing the Maximum Output Current
          5. 9.2.1.2.5  Selecting the Output Capacitor (C8 to C10)
          6. 9.2.1.2.6  Selecting the Input Capacitors (C2, C7)
          7. 9.2.1.2.7  Setting Output Voltage (R1, R2)
          8. 9.2.1.2.8  Setting the Soft-Start Time (C7)
          9. 9.2.1.2.9  Selecting the Schottky Diode (D1)
          10. 9.2.1.2.10 Compensating the Control Loop (R3, C4, C5)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 SEPIC Converter Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1  Selecting the Switching Frequency (R4)
          2. 9.2.2.2.2  Duty Cycle
          3. 9.2.2.2.3  Selecting the Inductor (L1)
          4. 9.2.2.2.4  Calculating the Maximum Output Current
          5. 9.2.2.2.5  Selecting the Output Capacitor (C8 to C10)
          6. 9.2.2.2.6  Selecting the Series Capacitor (C6)
          7. 9.2.2.2.7  Selecting the Input Capacitor (C2, C7)
          8. 9.2.2.2.8  Selecting the Schottky Diode (D1)
          9. 9.2.2.2.9  Setting the Output Voltage (R1, R2)
          10. 9.2.2.2.10 Setting the Soft-Start Time (C3)
          11. 9.2.2.2.11 MOSFET Rating Considerations
          12. 9.2.2.2.12 Compensating the Control Loop (R3, C4)
        3. 9.2.2.3 SEPIC Converter Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated