SLVSBV5C June   2014  – September 2021 TPS55340-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operation
      2. 7.3.2 Switching Frequency
      3. 7.3.3 Overcurrent Protection and Frequency Foldback
        1. 7.3.3.1 Minimum On Time and Pulse Skipping
      4. 7.3.4 Voltage Reference and Setting Output Voltage
      5. 7.3.5 Soft Start
      6. 7.3.6 Slope Compensation
      7. 7.3.7 Enable and Thermal Shutdown
      8. 7.3.8 Undervoltage Lockout (UVLO)
      9. 7.3.9 Thermal Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VI < 2.9 V (Minimum VI)
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Operation at Light Loads
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS55340-Q1 Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Selecting the Switching Frequency (R4)
          3. 8.2.1.2.3  Determining the Duty Cycle
          4. 8.2.1.2.4  Selecting the Inductor (L1)
          5. 8.2.1.2.5  Computing the Maximum Output Current
          6. 8.2.1.2.6  Selecting the Output Capacitor (C8 through C10)
          7. 8.2.1.2.7  Selecting the Input Capacitors (C2 and C7)
          8. 8.2.1.2.8  Setting the Output Voltage (R1 and R2)
          9. 8.2.1.2.9  Setting the Soft-Start Time (C7)
          10. 8.2.1.2.10 Selecting the Schottky Diode (D1)
          11. 8.2.1.2.11 Compensating the Control Loop (R3, C4, and C5)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TPS55340-Q1 SEPIC Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1  Selecting the Switching Frequency (R4)
          2. 8.2.2.2.2  Duty Cycle
          3. 8.2.2.2.3  Selecting the Inductor (L1)
          4. 8.2.2.2.4  Calculating the Maximum Output Current
          5. 8.2.2.2.5  Selecting the Output Capacitor (C8 Through C10)
          6. 8.2.2.2.6  Selecting the Series Capacitor (C6)
          7. 8.2.2.2.7  Selecting the Input Capacitor (C2 and C7)
          8. 8.2.2.2.8  Selecting the Schottky Diode (D1)
          9. 8.2.2.2.9  Setting the Output Voltage (R1 and R2)
          10. 8.2.2.2.10 Setting the Soft-Start Time (C3)
          11. 8.2.2.2.11 Mosfet Rating Considerations
          12. 8.2.2.2.12 Compensating the Control Loop (R3 and C4)
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-F1267867-DD2F-4A40-913B-7FBEA8907B7A-low.gif
TI recommends connecting NC with AGND.
Figure 5-1 16-Pin QFN With PowerPADRTE Package(Top View)
Table 5-1 Pin Functions
PIN DESCRIPTION
NAME NO.
AGND 6 Signal ground of the IC
COMP 7 Output of the transconductance error amplifier. An external RC network connected to this pin compensates the regulator feedback loop.
EN 3 Enable pin. When the voltage of this pin falls below the enable threshold for more than 1 ms, the IC turns off.
FB 8 Error amplifier input and feedback pin for positive voltage regulation. Connect the FB pin to the center tap of a resistor divider to program the output voltage.
FREQ 9 Switching frequency program pin. An external resistor connected between the FREQ pin and the AGND pin sets the switching frequency.
NC 10 This pin is reserved and must be connected to ground.
14
PGND 11 Power ground of the IC. The PGND pin is connected to the source of the internal power MOSFET switch.
12
13
SS 4 Soft-start programming pin. A capacitor between the SS pin and AGND pin programs soft-start timing.
SW 1 SW is the drain of the internal power MOSFET. Connect the SW pin to the switched side of the boost or SEPIC inductor or the flyback transformer.
15
16
SYNC 5 Switching frequency synchronization pin. An external clock signal can set the switching frequency between 200 kHz and 1 MHz. If this pin is not used, it must be tied to AGND.
VIN 2 The input supply pin to the IC. Connect the VIN pin to a supply voltage between 2.9 V and 32 V. The voltage on the VIN pin can be different from the boost power stage input.
PowerPAD The PowerPAD must be soldered to AGND. If possible, use thermal vias to connect the PowerPAD to PCB ground plane layers for improved power dissipation.