SLVSBD4E May   2012  – September 2021 TPS55340

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operation
      2. 7.3.2 Switching Frequency
      3. 7.3.3 Overcurrent Protection and Frequency Foldback
        1. 7.3.3.1 Minimum On-Time and Pulse Skipping
      4. 7.3.4 Voltage Reference and Setting Output Voltage
      5. 7.3.5 Soft-Start
      6. 7.3.6 Slope Compensation
      7. 7.3.7 Enable and Thermal Shutdown
      8. 7.3.8 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 2.9 V (Minimum VIN)
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Operation at Light Loads
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design with WEBENCH Tools
          2. 8.2.1.2.2  Selecting the Switching Frequency (R4)
          3. 8.2.1.2.3  Determining the Duty Cycle
          4. 8.2.1.2.4  Selecting the Inductor (L1)
          5. 8.2.1.2.5  Computing the Maximum Output Current
          6. 8.2.1.2.6  Selecting the Output Capacitors (C8, C9, C10)
          7. 8.2.1.2.7  Selecting the Input Capacitors (C2, C7)
          8. 8.2.1.2.8  Setting Output Voltage (R1, R2)
          9. 8.2.1.2.9  Setting the Soft-start Time (C7)
          10. 8.2.1.2.10 Selecting the Schottky Diode (D1)
          11. 8.2.1.2.11 Compensating the Control Loop (R3, C4, C5)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 SEPIC Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1  Selecting the Switching Frequency (R4)
          2. 8.2.2.2.2  Duty Cycle
          3. 8.2.2.2.3  Selecting the Inductor (L1)
          4. 8.2.2.2.4  Calculating the Maximum Output Current
          5. 8.2.2.2.5  Selecting the Output Capacitors (C8, C9, C10)
          6. 8.2.2.2.6  Selecting the Series Capacitor (C6)
          7. 8.2.2.2.7  Selecting the Input Capacitor (C2, C7)
          8. 8.2.2.2.8  Selecting the Schottky Diode (D1)
          9. 8.2.2.2.9  Setting the Output Voltage (R1, R2)
          10. 8.2.2.2.10 Setting the Soft-start Time (C3)
          11. 8.2.2.2.11 MOSFET Rating Considerations
          12. 8.2.2.2.12 Compensating the Control Loop (R3, C4)
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design with WEBENCH Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-D189656F-F094-4880-8261-0D83824ABBE6-low.gif
TI recommends connecting NC with AGND.
Figure 5-1 RTE Package16-Pin WQFNTop View
GUID-32F9B9DE-E2AD-4E3B-8B5C-DC8E03219EF7-low.gif
TI recommends connecting NC with AGND.
Figure 5-2 PWP Package14-Pin HTSSOP(Top View)
Table 5-1 Pin Functions
PIN DESCRIPTION
NAME QFN-16 HTSSOP-14
AGND 6 7 Signal ground of the IC
COMP 7 8 Output of the transconductance error amplifier. An external RC network connected to this pin compensates the regulator feedback loop.
EN 3 4 Enable pin. When the voltage of this pin falls below the enable threshold for more than 1 ms, the IC turns off.
FB 8 9 Error amplifier input and feedback pin for positive voltage regulation. Connect to the center tap of a resistor divider to program the output voltage.
FREQ 9 10 Switching frequency program pin. An external resistor connected between the FREQ pin and AGND sets the switching frequency.
NC 10, 14 11 Reserved pin that must be connected to ground
PGND 11, 12, 13 12, 13, 14 Power ground of the IC. It is connected to the source of the internal power MOSFET switch.
PowerPAD — — The PowerPAD should be soldered to the AGND. If possible, use thermal vias to connect to internal ground plane for improved power dissipation.
SS 4 5 Soft-start programming pin. A capacitor between the SS pin and AGND pin programs soft-start timing.
SW 1, 15, 16 1, 2 SW is the drain of the internal power MOSFET. Connect SW to the switched side of the boost or SEPIC inductor or the flyback transformer.
SYNC 5 6 Switching frequency synchronization pin. An external clock signal can be used to set the switching frequency between 200 kHz and 1.0 MHz. If not used, this pin should be tied to AGND.
VIN 2 3 The input supply pin to the IC. Connect VIN to a supply voltage between 2.9 V and 32 V. It is acceptable for the voltage on the pin to be different from the boost power stage input.