SLUSFG9A April   2024  – June 2024 TPS561243 , TPS561246

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adaptive On-Time Control and PWM Operation
      2. 6.3.2 Eco-mode Control
      3. 6.3.3 Soft Start and Prebiased Soft Start
      4. 6.3.4 Large Duty Operation
      5. 6.3.5 Current Protection
      6. 6.3.6 Enable Circuit
      7. 6.3.7 Undervoltage Lockout (UVLO) Protection
      8. 6.3.8 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Eco-mode Operation
      2. 6.4.2 FCCM Mode Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Output Voltage Resistors Selection
        3. 7.2.2.3 Output Filter Selection
        4. 7.2.2.4 Input Capacitor Selection
        5. 7.2.2.5 Bootstrap Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DRL (SOT-563) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 147.4 °C/W
RθJA_effective Junction-to-ambient thermal resistance on EVM board 73(2) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.7 °C/W
RθJB Junction-to-board thermal resistance 32.2 °C/W
ΨJT Junction-to-top characterization parameter 2.1 °C/W
YJB Junction-to-board characterization parameter 31.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) This RθJA_effective is tested on TPS562243EVM board (2 layer, copper thickness of top and bottom layer are 2oz) at TA = 25oC.