SLVSD91D December   2015  – September 2024 TPS562201 , TPS562208

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adaptive On-Time Control and PWM Operation
      2. 6.3.2 Pulse Skip Control (TPS562201)
      3. 6.3.3 Soft Start and Prebiased Soft Start
      4. 6.3.4 Current Protection
      5. 6.3.5 Undervoltage Lockout (UVLO) Protection
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Eco-mode Operation
      3. 6.4.3 Standby Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design with WEBENCH® Tools
        2. 7.2.2.2 Output Voltage Resistors Selection
        3. 7.2.2.3 Output Filter Selection
        4. 7.2.2.4 Input Capacitor Selection
        5. 7.2.2.5 Bootstrap Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design with WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDC|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TPS562201 and TPS562208UNIT
DDC (SOT)
6 PINS
RθJAJunction-to-ambient thermal resistance90.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance42.3°C/W
RθJBJunction-to-board thermal resistance16.3°C/W
ψJTJunction-to-top characterization parameter2.6°C/W
ψJBJunction-to-board characterization parameter16.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.