SLVSDT2 November   2016 TPS562219A , TPS563219A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
      1. 6.7.1 TPS562219A Characteristics
      2. 6.7.2 TPS563219A Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 The Adaptive On-Time Control and PWM Operation
      2. 7.3.2 Soft Start and Pre-Biased Soft Start
      3. 7.3.3 Power Good
      4. 7.3.4 Current Protection
      5. 7.3.5 Over Voltage Protection
      6. 7.3.6 UVLO Protection
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Forced CCM Operation
      3. 7.4.3 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application, TPS562219A
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Voltage Resistors Selection
          2. 8.2.1.2.2 Output Filter Selection
          3. 8.2.1.2.3 Input Capacitor Selection
          4. 8.2.1.2.4 Bootstrap capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application, TPS563219A
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedures
          1. 8.2.2.2.1 Output Filter Selection
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Documentation Support
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

TJ = -40°C to 150°C (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage range VIN, EN –0.3 19 V
VBST –0.3 25 V
VBST (10 ns transient) –0.3 27.5 V
VBST (vs SW) –0.3 6.5 V
VFB, PG –0.3 6.5 V
SS –0.3 5.5 V
SW –2 19 V
SW (10 ns transient) –3.5 21 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

TJ = –40°C to 150°C (unless otherwise noted)
MIN MAX UNIT
VIN Supply input voltage range 4.5 17 V
VI Input voltage range VBST –0.1 23 V
VBST (10 ns transient) –0.1 26
VBST(vs SW) –0.1 6
EN –0.1 17
VFB, PG –0.1 5.5
SS –0.1 5
SW –1.8 17
SW (10 ns transient) –3.5 20
TA Operating free-air temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS562219A TPS563219A UNIT
DDF (SOT)
8 PINS
RθJA Junction-to-ambient thermal resistance 106.1 87.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.1 41.6 °C/W
RθJB Junction-to-board thermal resistance 10.9 14.6 °C/W
ψJT Junction-to-top characterization parameter 8.6 4.7 °C/W
ψJB Junction-to-board characterization parameter 10.8 14.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TJ = –40°C to 150°C, VIN = 12 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IVIN Operating – non-switching supply current VIN current, TA = 25°C, EN = 5 V, VFB = 0.8 V 650 900 µA
IVINSDN Shutdown supply current VIN current, TA = 25°C, EN = 0 V 3 10 µA
LOGIC THRESHOLD
VENH EN high-level input voltage EN 1.6 V
VENL EN low-level input voltage EN 0.6 V
REN EN pin resistance to GND VEN = 12 V 225 450 900 kΩ
VFB VOLTAGE AND DISCHARGE RESISTANCE
VFBTH VFB threshold voltage TA = 25°C, VO = 1.05 V 757 765 773 mV
TA = 0°C to 85°C, VO = 1.05 V(1) 753 777
TA = -40°C to 85°C, VO = 1.05 V(1) 751 779
IVFB VFB input current VFB = 0.8V, TA = 25°C 0 ±0.1 µA
MOSFET
RDS(on)h High side switch resistance TA = 25°C, VBST – SW = 5.5 V, TPS562219A 133 mΩ
TA = 25°C, VBST – SW = 5.5 V, TPS563219A 68
RDS(on)l Low side switch resistance TA = 25°C, TPS562219A 80 mΩ
TA = 25°C, TPS563219A 39
CURRENT LIMIT
IOCL Current limit(1) DC current, VOUT = 1.05 V, L1 = 2.2 µH, TPS562219A 2.5 3.2 4.3 A
DC current, VOUT = 1.05 V, L1 = 1.5 µH, TPS563219A 3.5 4.2 5.3
THERMAL SHUTDOWN
TSDN Thermal shutdown threshold(1) Shutdown temperature 155 °C
Hysteresis 35
SOFT START
ISS SS charge current VSS = 1.2 V 4.2 6 7.8 µA
POWER GOOD
VTHPG PG threshold VFB rising (Good) 85% 90% 95%
VFB falling (Fault) 85%
IPG PG sink current PG = 0.5 V 0.5 1 mA
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
VOVP Output OVP threshold OVP Detect 125%xVfbth
VUVP Output UVP threshold Hiccup detect 65%xVfbth
tHiccupOn Hiccup Power On Time 1 cycle
tHiccupOff Hiccup Power Off Time 7
UVLO
UVLO UVLO threshold Wake up VIN voltage 3.45 3.75 4.05 V
Hysteresis VIN voltage 0.13 0.32 0.55
(1) Not production tested.

6.6 Timing Requirements

MIN TYP MAX UNIT
ON-TIME TIMER CONTROL
tON On time VIN = 12 V, VO = 1.05 V 150 ns
tOFF(MIN) Minimum off time TA = 25°C, VFB = 0.5 V 260 310 ns

6.7 Typical Characteristics

6.7.1 TPS562219A Characteristics

VIN = 12V (unless otherwise noted)

TPS562219A TPS563219A C011_SLVSCM7.png
Figure 1. Supply Current vs Junction Temperature
TPS562219A TPS563219A C013_SLVSCM7.png
Figure 3. VFB Voltage vs Junction Temperature
TPS562219A TPS563219A C015_SLVSCM7.png
Figure 5. Efficiency vs Output Current
TPS562219A TPS563219A C017_SLVSCM7.png
Figure 7. Switching Frequency vs Input Voltage
TPS562219A TPS563219A C012_SLVSCM7.png
Figure 2. VIN Shutdown Current vs Junction Temperature
TPS562219A TPS563219A C014_SLVSCM7.png
Figure 4. EN Current vs EN Voltage
TPS562219A TPS563219A C016_SLVSCM7.png
Figure 6. Efficiency vs Output Current (VI= 5V)
TPS562219A TPS563219A C018_SLVSCM7.png
Figure 8. Switching Frequency vs Output Current

6.7.2 TPS563219A Characteristics

TPS562219A TPS563219A C019_SLVSCM7.png
Figure 9. Supply Current vs Junction Temperature
TPS562219A TPS563219A C021_SLVSCM7.png
Figure 11. VFB Voltage vs Junction Temperature
TPS562219A TPS563219A C023_SLVSCM7.png
Figure 13. Efficiency vs Output Current
TPS562219A TPS563219A C025_SLVSCM7.png
Figure 15. Switching Frequency vs Input Voltage
TPS562219A TPS563219A C020_SLVSCM7.png
Figure 10. VIN Shutdown Current vs Junction Temperature
TPS562219A TPS563219A C022_SLVSCM7.png
Figure 12. EN Current vs EN Voltage
TPS562219A TPS563219A C024_SLVSCM7.png
Figure 14. Efficiency vs Output Current (VI = 5V)
TPS562219A TPS563219A C026_SLVSCM7.png
Figure 16. Switching Frequency vs Output Current