SLVSGV8 October   2022 TPS568231

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation and D-CAP3™ Control Mode
      2. 7.3.2  Eco-mode™ Control
      3. 7.3.3  4.7-V LDO
      4. 7.3.4  MODE Selection
      5. 7.3.5  Soft Start and Prebiased Soft Start
      6. 7.3.6  Enable and Adjustable UVLO
      7. 7.3.7  Power Good
      8. 7.3.8  Overcurrent Protection and Undervoltage Protection
      9. 7.3.9  UVLO Protection
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Output Voltage Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Operation
      2. 7.4.2 Standby Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Output Voltage Set Point
          2. 8.2.2.1.2 Switching Frequency and MODE Selection
          3. 8.2.2.1.3 Inductor Selection
          4. 8.2.2.1.4 Output Capacitor Selection
          5. 8.2.2.1.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1)RNN (JEDEC)RNN (TI EVM)UNIT
18 PINS
RθJAJunction-to-ambient thermal resistance49.927°C/W
RθJC(top)Junction-to-case (top) thermal resistance24.9Not applicable2°C/W
RθJBJunction-to-board thermal resistance11.3Not applicable2°C/W
ψJTJunction-to-top characterization parameter0.50.4°C/W
ψJBJunction-to-board characterization parameter1110°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
Not applicable to an EVM layout