SLVSGM3B March   2023  – January 2024 TPS56836 , TPS56837 , TPS56838

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  The Adaptive On-Time Control and PWM Operation
      2. 6.3.2  Mode Selection
      3. 6.3.3  Soft Start and Pre-Biased Soft Start
      4. 6.3.4  Enable and Adjusting Undervoltage Lockout
      5. 6.3.5  Output Overcurrent Limit and Undervoltage Protection
      6. 6.3.6  Overvoltage Protection
      7. 6.3.7  UVLO Protection
      8. 6.3.8  Thermal Shutdown
      9. 6.3.9  Output Voltage Discharge
      10. 6.3.10 Power Good
      11. 6.3.11 Large Duty Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Standby Operation
      2. 6.4.2 Eco-mode
      3. 6.4.3 Forced Continuous Conduction Mode
      4. 6.4.4 Out-of-Audio™ Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Output Voltage Resistors Selection
        3. 7.2.2.3 Output Filter Selection
        4. 7.2.2.4 Input Capacitor Selection
        5. 7.2.2.5 Bootstrap Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

  1. Use a four-layer PCB with maximum ground plane partitioning possible for good thermal performance. A 76mm × 76mm, four-layer PCB with 2-1-1-2 oz copper is used as example.
  2. Make VIN and PGND traces as wide as possible to reduce trace impedance. The wide areas are also of advantage from the view point of heat dissipation.
  3. Put at least two vias for PGND pad for better thermal performance.
  4. Place the input capacitor and output capacitor as close to the device as possible to minimize trace impedance.
  5. Provide sufficient vias for the input capacitor and output capacitor.
  6. Keep the SW trace as physically short and wide as practical to minimize radiated emissions.
  7. Do not allow switching current to flow under the device.
  8. Keep the SS trace as far as possible to SW trace to minimize coupling during soft start.
  9. Connect a separate VOUT path to the upper feedback resistor.
  10. Keep the voltage feedback loop away from the high-voltage switching trace, and preferably has ground shield.
  11. Make the trace of the VFB node as small as possible to avoid noise coupling. Also keep feedback resistors and the feedforward capacitor near the IC.
  12. Make the PGND trace between the output capacitor and the PGND pin as wide as possible to minimize the trace impedance.
  13. Note that inner layer 1 is PGND and AGND with the single point net tie.
  14. Note that inner layer 2 is PGND for better heat dissipation.