SLVSGB5 August 2022 TPS56C231
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | RNN (JEDEC) | RNN (TI EVM) | UNIT | |
---|---|---|---|---|
18 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 49.9 | 27 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 24.9 | Not applicable2 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.3 | Not applicable2 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.5 | 0.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 11 | 10 | °C/W |