SLVSD01B September   2015  – May 2019 TPS57140-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Load Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope-Compensation Output Current
      3. 7.3.3  Bootstrap Voltage (Boot)
      4. 7.3.4  Low-Dropout Operation
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Voltage Reference
      7. 7.3.7  Adjusting the Output Voltage
      8. 7.3.8  Enable and Adjusting UVLO
      9. 7.3.9  Slow-Start or Tracking Pin (SS/TR)
      10. 7.3.10 Overload Recovery Circuit
      11. 7.3.11 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      12. 7.3.12 Overcurrent Protection and Frequency Shift
      13. 7.3.13 Selecting the Switching Frequency
      14. 7.3.14 How to Interface to RT/CLK Pin
      15. 7.3.15 Power Good (PWRGD Pin)
      16. 7.3.16 Overvoltage Transient Protection (OVTP)
      17. 7.3.17 Thermal Shutdown
      18. 7.3.18 Small-Signal Model for Loop Response
      19. 7.3.19 Simple Small-Signal Model for Peak-Current-Mode Control
      20. 7.3.20 Small-Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sequencing
      2. 7.4.2 Pulse-Skip Eco-mode Control Scheme
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Switching Frequency
        2. 8.2.2.2  Output Inductor Selection (LO)
        3. 8.2.2.3  Output Capacitor
        4. 8.2.2.4  Catch Diode
        5. 8.2.2.5  Input Capacitor
        6. 8.2.2.6  Slow-Start Capacitor
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  UVLO Set Point
        9. 8.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 8.2.2.10 Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power-Dissipation Estimate
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(2) TPS57140-EP UNIT
DRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance Standard board 56.5 °C/W
Custom board(3) 61.5
RθJC(top) Junction-to-case (top) thermal resistance 52.1 °C/W
RθJB Junction-to-board thermal resistance 20.8 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 20.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where distortion starts to increase substantially. See Power-Dissipation Estimate for more information.
(3) Test-board conditions:
  1. 3 inches (7.62 cm) × 3 inches (7.62 cm), 2 layers, thickness: 0.062 inch (1.57 mm)
  2. 2-oz. (0.071-mm thick) copper traces located on the top of the PCB
  3. 2-oz. (0.071-mm thick) copper ground plane, bottom layer
  4. 6 thermal vias (13 mil (1 mil = 0.0254 mm)) located under the device package