SLVS274A March   2000  – April 2016 TPS60200 , TPS60201 , TPS60202 , TPS60203

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Tables
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics - Low-Battery Comparator
    7. 7.7 Electrical Characteristics - Power-Good Comparator
    8. 7.8 Typical Characteristic
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Start-Up, Shutdown, and Auto-Discharge
      2. 8.3.2 Synchronization to an External Clock Signal
      3. 8.3.3 Power-Good Detector
    4. 8.4 Device Functional Modes
      1. 8.4.1 Push-Pull Operating Mode
      2. 8.4.2 Constant-Frequency Mode
      3. 8.4.3 Pulse-Skip Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Capacitor Selection
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Low-Battery Detector (TPS60200 and TPS60202)
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

Careful board layout is necessary due to the high transient currents and switching frequency of the converter. All capacitors should be placed in close proximity to the device. A PCB layout proposal for a one-layer board is given in Figure 21.

An evaluation module for the TPS60200 is available and can be ordered under product code TPS60200EVM–145. The EVM uses the layout shown in Figure 21. All components including the pins are shown. The EVM is built so that it can be connected to a 14-pin dual inline socket; therefore, the space needed for the IC, the external parts, and 8 pins is 17.9 mm × 10.2 mm = 182.6 mm2.

11.2 Layout Example

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TPS60200 TPS60201 TPS60202 TPS60203 rec_component_placement_board_layout_slvs274.gif Figure 21. TPS6020x EVM Board Layout

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Table 6. Component Identification

IC1 TPS60200
C1, C2 Flying capacitors
C3 Input capacitors
C4 Output capacitors
C5(1) Stabilization capacitor for LBI
R1, R2 Resistive divider for LBI
R3 Pullup resistor for LBO
R4 Pullup resistor for EN
(1) Capacitor C5 should be included if large line transients are expected. This capacitor suppresses toggling of the LBO due to these line changes.

11.3 Power Dissipation

The power dissipated in the TPS6020x devices depends mainly on input voltage and output current and is approximated with Equation 5.

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Equation 5. TPS60200 TPS60201 TPS60202 TPS60203 equation_05_slvs274.gif

By observing Equation 5, it can be seen that the power dissipation is worst for highest input voltage VI and highest output current IO. For an input voltage of 3.6 V and an output current of 100 mA the calculated power dissipation P(DISS) is 390 mW. This is also the point where the charge pump operates with its lowest efficiency.

With the recommended maximum junction temperature of 125°C and an assumed maximum ambient operating temperature of 85°C, the maximum allowed thermal resistance junction to ambient of the system is calculated with Equation 6.

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Equation 6. TPS60200 TPS60201 TPS60202 TPS60203 equation_06_slvs274.gif

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PDISS must be less than that allowed by the package rating. The thermal resistance junction to ambient of the used 10-pin MSOP is 294°C/W for an unsoldered package. The thermal resistance junction to ambient with the IC soldered to a printed circuit using a board layout as described in Application Information, the RθJA is typically 200°C/W, which is higher than the maximum value calculated above. However in a battery-powered application, both VI and TA will typically be lower than the worst-case ratings used in Equation 6, and power dissipation should not be a problem in most applications.