SLVS354B february   2001  – may 2023 TPS60204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Dissipation Rating
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Electrical Characteristics TPS60204
    6. 7.6 Electrical Characteristics TPS60205
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagrams
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Power Dissipation
    4. 9.4 Layout and Board Space
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage IN to GND -0.3 3.6 V
EN, PG to GND -0.3 3.6
LBI, LBO to GND -0.3 3.6
Output voltage OUT to GND -0.3 3.6 V
C1+, C2+ to GND -0.3 VO + 0.3 V
C1-, C2- to GND -0.3 VI + 0.3
Output current OUT 150 mA
Storage temperature Tstg -55 150 °C
Maximum junction temperature TJ 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.