SLVS354B february   2001  – may 2023 TPS60204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Dissipation Rating
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Electrical Characteristics TPS60204
    6. 7.6 Electrical Characteristics TPS60205
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagrams
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Power Dissipation
    4. 9.4 Layout and Board Space
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3 Power Dissipation

The power dissipated in the TPS6020x devices depends mainly on input voltage and output current and is approximated by:

Equation 5. P D I S S = I O × 2 × V I - V O

for

Equation 6. I Q < I O

By observing equation 5, it can be seen that the power dissipation is worst for highest input voltage VI and highest output current IO. For an input voltage of 3.6 V and an output current of 100 mA the calculated power dissipation P(DISS) is 390 mW. This is also the point where the charge pump operates with its lowest efficiency.

With the recommended maximum junction temperature of 125°C and an assumed maximum ambient operating temperature of 85°C, the maximum allowed thermal resistance junction to ambient of the system can be calculated.

Equation 7. R θ J A m a x = T J M A X - T A P D I S S m a x = 125 ℃ - 85 ℃ 390   m W = 102 ℃ / W

PDISS must be less than that allowed by the package rating. The thermal resistance junction to ambient of the used 10-pin MSOP is 294°C/W for an unsoldered package. The thermal resistance junction to ambient with the IC soldered to a printed circuit using a board layout as described in the application information section, the RΘJA is typically 200°C/W, which is higher than the maximum value calculated above. However, in a battery powered application, both VI and TA will typically be lower than the worst case ratings used in equation 6 , and power dissipation should not be a problem in most applications.