Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
DGS|10
Thermal pad, mechanical data (Package|Pins)
4 Revision History
Changes from C Revision (April 2003) to D Revision
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
Replaced the Dissipation Ratings table with the Thermal Information tableGo