SLVS314F SEPTEMBER   2000  – August 2015 TPS61010 , TPS61012 , TPS61013 , TPS61014 , TPS61015 , TPS61016

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
      1. 7.6.1 Table of Graphs
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Controller Circuit
      2. 9.3.2 Synchronous Rectifier
      3. 9.3.3 Power-Save Mode
      4. 9.3.4 Device Enable
      5. 9.3.5 Undervoltage Lockout (UVLO)
      6. 9.3.6 Autodischarge
      7. 9.3.7 Low-Battery Detector Circuit (LBI and LBO)
      8. 9.3.8 Antiringing Switch
      9. 9.3.9 Adjustable Output Voltage
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 1.8-mm Maximum Height Power Supply With Single Battery Cell Input Using Low Profile Components
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Programming the TPS61010 Adjustable Output Voltage Device
          2. 10.2.1.2.2 Programming the Low Battery Comparator Threshold Voltage
          3. 10.2.1.2.3 Inductor Selection
          4. 10.2.1.2.4 Capacitor Selection
          5. 10.2.1.2.5 Compensation of the Control Loop
        3. 10.2.1.3 Application Curves
      2. 10.2.2 250-mA Power Supply With Two Battery Cell Input
      3. 10.2.3 Dual Output Voltage Power Supply for DSPs
      4. 10.2.4 Power Supply With Auxiliary Positive Output Voltage
      5. 10.2.5 Power Supply With Auxiliary Negative Output Voltage
      6. 10.2.6 TPS6101x EVM Circuit Diagram
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.