SLVSDM0 June   2016 TPS61021A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Under-Voltage Lockout
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Switching Frequency
      4. 7.3.4 Current Limit Operation
      5. 7.3.5 Pass-Through Operation
      6. 7.3.6 Over-Voltage Protection
      7. 7.3.7 Output Short-to-Ground Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 Power Save Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Feedforward Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage range at terminals(2) EN, FB DC –0.3 3.6 V
VIN, SW, VOUT DC –0.3 4.6 V
10% duty cycle –0.3 4.8 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage range 0.5 4.4 V
VOUT Output voltage setting range 1.8 4.0 V
L Effective inductance range 0.2 0.47 1.3 µH
CIN Effective input capacitance range 1.0 4.7 µF
COUT Effective output capacitance range IOUT ≤ 0.3 A 3.0 10 200 µF
IOUT > 0.3 A 10 20 200 µF
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS61021A UNIT
DSG (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 71.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 95.2 °C/W
RθJB Junction-to-board thermal resistance 41.6 °C/W
ψJT Junction-to-top characterization parameter 3.1 °C/W
ψJB Junction-to-board characterization parameter 42.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 13.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TJ = –40°C to 125°C, VIN = 2.4 V and VOUT = 3.3 V. Typical values are at TJ = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
VIN Input voltage range 0.5 4.4 V
VIN_UVLO Under-voltage lockout threshold VIN rising 0.8 0.9 V
VIN falling 0.28 0.4 0.5 V
IQ Quiescent current into VIN pin IC enabled, No load, No switching VIN = 1.8 V to 3.6 V, VFB = VREF + 0.1 V, TJ up to 85°C 3.0 µA
Quiescent current into VOUT pin IC enabled, No load, No switching VOUT = 1.8 V to 4.0 V, VFB = VREF + 0.1 V, TJ up to 85°C 17 30 µA
ISD Shutdown current into VIN and SW pin IC disabled, VIN = 1.8 V to 3.6 V, TJ up to 85°C 0.5 3.0 µA
OUTPUT
VOUT Output voltage setting range 1.8 4.0 V
VREF Reference voltage at the FB pin PWM mode 775 795 815 mV
PFM mode 801 mV
VOVP Output over-voltage protection threshold VOUT rising 4.15 4.35 4.60 V
VOVP_HYS Over-voltage protection hysteresis 0.1 V
IFB_LKG Leakage current at FB pin 20 nA
ISW_LKG Leakage current into SW pin IC disabled, TJ up to 85°C 3.0 µA
IVOUT_LKG Leakage current into VOUT pin IC disabled, VOUT = 4.0 V, TJ up to 85°C 1 2 µA
POWER SWITCH
RDS(on) High-side MOSFET on resistance VOUT = 3.3 V 51 mΩ
Low-side MOSFET on resistance VOUT = 3.3 V 58 mΩ
fSW Switching frequency VIN = 2.4 V, VOUT = 3.3 V, PWM mode 2.0 MHZ
tOFF_min Minimum off time 80 120 ns
ILIM_SW Valley current limit VIN = 2.4 V, VOUT = 3.3 V 3.0 4.3 A
LOGIC INTERFACE
VEN_H EN Logic high threshold VIN > 1.2 V 0.84 V
VIN ≤ 1.2 V 0.7 x VIN
VEN_L EN Logic Low threshold VIN > 1.2 V 0.36 V
VIN ≤ 1.2 V 0.3 x VIN
PROTECTION
TSD Thermal shutdown threshold TJ rising 150 °C
TSD_HYS Thermal shutdown hysteresis TJ falling below TSD 20 °C

6.6 Typical Characteristics

VIN = 2.4 V, VOUT = 3.3 V, TJ = 25°C, unless otherwise noted
TPS61021A D001_SLVSD21.gif
VIN = 0.9 V, 1.2 V, 1.8 V, 2.4 V, 3.0 V, and VOUT = 3.3 V
Figure 1. Load Efficiency with Different Input
TPS61021A D003_SLVSD21.gif
VIN = 0.7 V to 3.6 V, VOUT = 2.5 V, 3.3 V, 4.0 V
Figure 3. Maximum Output Current vs Input Voltage
TPS61021A D005_SLVSD21.gif
VIN = 2.4 V, VOUT = 3.3 V, T = –40°C to 125°C
Figure 5. Reference Voltage vs Temperature
TPS61021A D007_SLVSD21.gif
VIN = 1.2 V, VOUT = 1.8 V to 4.0 V, No switching
Figure 7. Quiescent Current into VOUT vs Output Voltage
TPS61021A D009_SLVSD21.gif
VIN = 2.4 V, Into VIN and SW, T = –40°C to 85°C
Figure 9. Shutdown Current vs Temperature
TPS61021A D002_SLVSD21.gif
VIN = 2.4 V, and VOUT = 2.5 V, 3.3 V, 4.0 V
Figure 2. Load Efficiency with Different Output
TPS61021A D004_SLVSD21.gif
VIN = 0.9 V, 1.6 V, 2.4 V, 3.0 V, and VOUT = 3.3 V
Figure 4. Load Regulation
TPS61021A D006_SLVSD21.gif
VIN = 0.9 V to 3.6 V, VOUT = 4.0 V, No switching
Figure 6. Quiescent Current into VIN vs Input Voltage
TPS61021A D008_SLVSD21.gif
VIN = 2.4 V, VOUT = 3.3 V, No switching, T = –40°C to 85°C
Figure 8. Quiescent Current into VOUT vs Temperature