SLVSH62 November   2023 TPS61033-Q1 , TPS610333-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Undervoltage Lockout
      2. 7.3.2  Enable and Soft Start
      3. 7.3.3  Setting the Output Voltage
      4. 7.3.4  Current Limit Operation
      5. 7.3.5  Pass-Through Operation
      6. 7.3.6  Power Good Indicator
      7. 7.3.7  Implement Output Discharge by PG function
      8. 7.3.8  Spread Spectrum Frequency Modulation
      9. 7.3.9  Overvoltage Protection
      10. 7.3.10 Output Short-to-Ground Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 Power-Save Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS61033-Q1 TPS61033-Q1 UNIT
DRL (SOT583)- 8 PINS DRL (SOT583)- 8 PINS
Standard EVM(2)
RθJA Junction-to-ambient thermal resistance 117.5 65.8 °C/W
RθJC Junction-to-case thermal resistance 40.0 NA °C/W
RθJB Junction-to-board thermal resistance 23.0 NA °C/W
ΨJT Junction-to-top characterization parameter 2.8 1.0 °C/W
ΨJB Junction-to-board characterization parameter 22.9 28.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on TPS61033EVM, 4-layer, 2oz copper NA PCB.