SLVS859B June   2008  – December 2014 TPS61085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Soft-Start
      2. 8.3.2 Frequency Select Pin (FREQ)
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Overvoltage Prevention
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Design Procedure
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Rectifier Diode Selection
        4. 9.2.2.4 Setting the Output Voltage
        5. 9.2.2.5 Compensation (COMP)
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 General Boost Application Circuits
      2. 9.3.2 TFT LCD Application Circuit
      3. 9.3.3 WHITE LED Application Circuits
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from A Revision (April 2012) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from * Revision (June 2008) to A Revision

  • Changed the circuit illustration value of CCOMP From: 1.6 nF To: 1.1 nFGo
  • Deleted Lead Temperature from the Abs Max tableGo
  • Added a conditions statement and two new graphs (Max Load Current vs Input Voltage) to the Typical Characteristics graphsGo
  • Added three paragraphs of text to the Detailed Description.Go
  • Changed Figure 8 to Figure 17Go
  • Changed the Design Procudures step 3 details following Equation 4Go
  • Changed text in the Inductor Selection section "inductor current ripple is below 20%" to " inductor current ripple is below 35%" Go
  • Changed Equation 8Go
  • Added Used IOUT to Table 5Go
  • Added Equation 10Go
  • Changed the White LED Applications optional Zener connection for Figure 19 to Figure 21Go