SLVS821E May   2008  – May 2019 TPS61087

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft-Start
      2. 7.3.2 Frequency Select Pin (FREQ)
      3. 7.3.3 Undervoltage Lockout (UVLO)
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Overvoltage Prevention
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Rectifier Diode Selection
        3. 8.2.2.3 Setting the Output Voltage
        4. 8.2.2.4 Compensation (COMP)
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 General Boost Application Circuits
      2. 8.3.2 TFT LCD Application
      3. 8.3.3 White LED Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS61087 UNIT
DRC DSC
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 54.7 55.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.2 84.8 °C/W
RθJB Junction-to-board thermal resistance 29.6 29.7 °C/W
ψJT Junction-to-top characterization parameter 2.3 5.4 °C/W
ψJB Junction-to-board characterization parameter 29.8 29.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 15.6 10.9 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.