SLVSE52A September   2018  – November 2018 TPS61088-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable and Start-up
      2. 8.3.2 Undervoltage Lockout (UVLO)
      3. 8.3.3 Adjustable Switching Frequency
      4. 8.3.4 Adjustable Peak Current Limit
      5. 8.3.5 Overvoltage Protection
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
        1. 8.4.1.1 PWM Mode
        2. 8.4.1.2 PFM Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design with WEBENCH Tools
        2. 9.2.2.2 Setting Switching Frequency
        3. 9.2.2.3 Setting Peak Current Limit
        4. 9.2.2.4 Setting Output Voltage
        5. 9.2.2.5 Inductor Selection
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 Output Capacitor Selection
        8. 9.2.2.8 Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design with WEBENCH Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Example

The bottom layer is a large ground plane connected to the PGND plane and AGND plane on top layer by vias.

TPS61088-Q1 layout_ex_LVSCM8.gifFigure 21. Recommended TPS61088-Q1 Layout