SLVSD38C November   2015  – August 2021 TPS61089

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Enable and Disable
      3. 8.3.3 Soft Start
      4. 8.3.4 Adjustable Switching Frequency
      5. 8.3.5 Adjustable Peak Current Limit
      6. 8.3.6 Overvoltage Protection
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
        1. 8.4.1.1 Forced PWM Mode
        2. 8.4.1.2 PFM Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting Switching Frequency
        3. 9.2.2.3 Setting Peak Current Limit
        4. 9.2.2.4 Setting Output Voltage
        5. 9.2.2.5 Inductor Selection
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 Output Capacitor Selection
        8. 9.2.2.8 Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS61089xUNIT
RNR (VQFN)
11 PINS
RθJA Junction-to-ambient thermal resistance 53.4°C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.2°C/W
RθJB Junction-to-board thermal resistance 9.6°C/W
ψJT Junction-to-top characterization parameter 0.5°C/W
ψJB Junction-to-board characterization parameter 9.5°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.7°C/W
RθJA(EVM)(2) Junction-to-ambient thermal resistance on EVM39.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The EVM board is a 4-layer PCB of 76-mm x 52-mm size. The copper thickness of top layer and bottom layer is 2 oz. The copper thickness of inner layers is 1 oz.