SLVSD38C November   2015  – August 2021 TPS61089

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Enable and Disable
      3. 8.3.3 Soft Start
      4. 8.3.4 Adjustable Switching Frequency
      5. 8.3.5 Adjustable Peak Current Limit
      6. 8.3.6 Overvoltage Protection
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
        1. 8.4.1.1 Forced PWM Mode
        2. 8.4.1.2 PFM Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting Switching Frequency
        3. 9.2.2.3 Setting Peak Current Limit
        4. 9.2.2.4 Setting Output Voltage
        5. 9.2.2.5 Inductor Selection
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 Output Capacitor Selection
        8. 9.2.2.8 Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.2.1 Thermal Considerations

The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 20.

Equation 20. GUID-7A301CE5-8060-4F4F-8519-DB2C0FA63774-low.gif

where

  • TA is the maximum ambient temperature for the application
  • RθJA is the junction-to-ambient thermal resistance given in the Thermal Information table

The TPS61089x comes in a thermally-enhanced VQFN package. The pads underneath the package improve the thermal capabilities of the package. The real junction-to-ambient thermal resistance of the package greatly depends on the PCB type, layout, and pad connection. Using thick PCB copper and soldering the SW pin, VOUT pin, and GND pin to large copper plate enhances the thermal performance. Using more vias connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability.