SLVSFH6C January   2021  – December 2021 TPS61094

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 The Configuration of VCHG Pin, ICHG Pin, and OSEL Pin
        1. 7.1.1.1 OSEL: Output Voltage Selection
        2. 7.1.1.2 VCHG: Charging Termination Voltage Selection
        3. 7.1.1.3 ICHG: Charging Output Current Selection
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Active Pulldown for the EN and MODE Pins
      4. 7.3.4 Current Limit Operation
      5. 7.3.5 Output Short-to-Ground Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Mode Setting
      2. 7.4.2 Forced Bypass Mode Operation
      3. 7.4.3 True Shutdown Mode Operation
      4. 7.4.4 Forced Buck Mode Operation
      5. 7.4.5 Auto Buck or Boost Mode Operation
        1. 7.4.5.1 Three States (Boost_on, Buck_on, and Supplement) Transition
        2. 7.4.5.2 Boost, Bypass, and Pass-Through
        3. 7.4.5.3 PWM, PFM, and Snooze Modes in Boost Operation
          1. 7.4.5.3.1 PWM Mode
          2. 7.4.5.3.2 PFM Mode
          3. 7.4.5.3.3 Snooze Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application – 3.6-V Output Boost Converter with Bypass
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Output Voltage
        2. 8.2.2.2 Maximum Output Current
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application – 3.3-V Output Boost Converter with Automatic Buck or Boost Function
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 Programming the Voltage and Current
        3. 8.2.4.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.5 Input Capacitor Selection

Multilayer X5R or X7R ceramic capacitors are excellent choices for the input decoupling of the step-up converter as they have extremely low ESR and are available in small footprints. Input capacitors must be located as close as possible to the device. While a 10-μF input capacitor is sufficient for most applications, larger values can be used to reduce input current ripple without limitations. Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the power is being supplied through long wires, a load step at the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance, place additional bulk capacitance (tantalum or aluminum electrolytic capacitor) between ceramic input capacitor and the power source to reduce ringing that can occur between the inductance of the power source leads and ceramic input capacitor.