SLVSFH6C January   2021  – December 2021 TPS61094

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 The Configuration of VCHG Pin, ICHG Pin, and OSEL Pin
        1. 7.1.1.1 OSEL: Output Voltage Selection
        2. 7.1.1.2 VCHG: Charging Termination Voltage Selection
        3. 7.1.1.3 ICHG: Charging Output Current Selection
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Active Pulldown for the EN and MODE Pins
      4. 7.3.4 Current Limit Operation
      5. 7.3.5 Output Short-to-Ground Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Mode Setting
      2. 7.4.2 Forced Bypass Mode Operation
      3. 7.4.3 True Shutdown Mode Operation
      4. 7.4.4 Forced Buck Mode Operation
      5. 7.4.5 Auto Buck or Boost Mode Operation
        1. 7.4.5.1 Three States (Boost_on, Buck_on, and Supplement) Transition
        2. 7.4.5.2 Boost, Bypass, and Pass-Through
        3. 7.4.5.3 PWM, PFM, and Snooze Modes in Boost Operation
          1. 7.4.5.3.1 PWM Mode
          2. 7.4.5.3.2 PFM Mode
          3. 7.4.5.3.3 Snooze Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application – 3.6-V Output Boost Converter with Bypass
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Output Voltage
        2. 8.2.2.2 Maximum Output Current
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application – 3.3-V Output Boost Converter with Automatic Buck or Boost Function
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 Programming the Voltage and Current
        3. 8.2.4.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS61094 TPS61094 UNIT
DSS 12-PINS DSS 12-PINS
Standard EVM
RθJA Junction-to-ambient thermal resistance 58.4 55.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.0 N/A °C/W
RθJB Junction-to-board thermal resistance 55.6 N/A °C/W
ΨJT Junction-to-top characterization parameter 1.6 1.5 °C/W
YJB Junction-to-board characterization parameter 22.9 22.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 10.0 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.