SLVS873F June   2015  – September 2021 TPS61098 , TPS610981 , TPS610982 , TPS610985 , TPS610986 , TPS610987

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Boost Controller Operation
      2. 8.3.2 Pass-Through Operation
      3. 8.3.3 LDO / Load Switch Operation
      4. 8.3.4 Start Up and Power Down
      5. 8.3.5 Over Load Protection
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation Modes by MODE Pin
        1. 8.4.1.1 Active Mode
        2. 8.4.1.2 Low Power Mode
      2. 8.4.2 Burst Mode Operation under Light Load Condition
      3. 8.4.3 Pass-Through Mode Operation
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 VMAIN to Power MCU and VSUB to Power Subsystem
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Device Choice
          2. 9.2.1.2.2 Maximum Output Current
          3. 9.2.1.2.3 Inductor Selection
          4. 9.2.1.2.4 Capacitor Selection
          5. 9.2.1.2.5 Control Sequence
        3. 9.2.1.3 Application Curves
      2. 9.2.2 VMAIN to Power the System in Low Power Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 VSUB to Power the System in Active Mode
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TPS61098xUNIT
DSE 6 PINS
RθJAJunction-to-ambient thermal resistance207.3°C/W
RθJCtopJunction-to-case (top) thermal resistance118.9°C/W
RθJBJunction-to-board thermal resistance136.4°C/W
ψJTJunction-to-top characterization parameter8.3°C/W
ψJBJunction-to-board characterization parameter136.4°C/W
RθJCbotJunction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metrics application report.