SLVS625E February   2006  – November 2015 TPS61150 , TPS61151

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Tables
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-Up
      2. 8.3.2 Overvoltage Protection (OVP)
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Enable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Current Regulation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Output Current
        2. 9.2.2.2 WLED Brightness Dimming
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Input and Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Additional Application Circuits
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DRC Package
10-Pin VSON With Exposed Thermal Pad
Top View
TPS61150 TPS61151 po_slvs625.gif

Pin Functions

PIN I/O DESCRIPTION
NUMBER NAME
1, 10 IFB1, IFB2 I The return path for the IOUT regulation. Current regulator is connected to this pin, and it can be disabled to open the current path.
2, 9 ISET1, ISET2 I Output current programming pins. The resistor connected to the pin programs its corresponding output current.
3, 4 SEL1, SEL2 I Mode selection pins. See Table 2 for details.
5 VIN I The input pin to the device. It provides the current to the boost power stage and also powers the device circuit. When VIN is below the undervoltage lockout threshold, the device turns off and disables outputs, thus disconnecting the WLEDs from the input.
6 SW I This is the switching node of the device.
7 IOUT O The output of the constant current supply. It is directly connected to the boost converter output.
8 GND O The ground of the device. Connect the input and output capacitors very close to this pin.
— Thermal Pad — The thermal pad should be soldered to the analog ground. If possible, use thermal via to connect to ground plane for ideal power dissipation.