SLVSC26B November   2013  – May 2024 TPS61162A , TPS61163A

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 EasyScale Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Boost Converter
      2. 6.3.2  IFBx Pin Unused
      3. 6.3.3  Enable and Start-up
      4. 6.3.4  Soft Start
      5. 6.3.5  Full-Scale Current Program
      6. 6.3.6  Brightness Control
      7. 6.3.7  Undervoltage Lockout
      8. 6.3.8  Overvoltage Protection
      9. 6.3.9  Overcurrent Protection
      10. 6.3.10 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 One-Wire Digital Interface (EasyScale Interface)
      2. 6.4.2 PWM Control Interface
    5. 6.5 Programming
      1. 6.5.1 EasyScale Programming
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Schottky Diode Selection
        3. 7.2.2.3 Compensation Capacitor Selection
        4. 7.2.2.4 Output Capacitor Selection
      3. 7.2.3 Application Curves
      4. 7.2.4 Additional Application Circuits
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Related Links
    3. 8.3 Community Resources
    4. 8.4 Trademarks
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

As for all switching power supplies, especially those providing high current and using high switching frequencies, layout is an important design step. If layout is not carefully done, the regulator could show instability as well as EMI problems. Therefore, use wide and short traces for high current paths. The input capacitor, C1 in Section 7.2.4, needs to be close to the inductor, as well as the VIN pin and GND pin in order to reduce the input ripple seen by the device. If possible, choose higher capacitance value for it. If the ripple seen at VIN pin is so large that it affects the boost loop stability or internal circuits operation, R2 and C3 are recommended to filter and decouple the noise. In this case, C3 should be placed as close as possible to the VIN and GND pins. The SW pin carries high current with fast rising and falling edges. Therefore, the connection between the SW pin to the inductor and Schottky diode should be kept as short and wide as possible. The trace between Schottky diode and the output capacitor C2 should also be as short and wide as possible. It is also beneficial to have the ground of the output capacitor C2 close to the GND pin since there is a large ground return current flowing between them. When laying out signal grounds, it is recommended to use short traces separated from power ground traces, and connect them together at a single point close to the GND pin.