SLVSC26B November   2013  – May 2024 TPS61162A , TPS61163A

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 EasyScale Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Boost Converter
      2. 6.3.2  IFBx Pin Unused
      3. 6.3.3  Enable and Start-up
      4. 6.3.4  Soft Start
      5. 6.3.5  Full-Scale Current Program
      6. 6.3.6  Brightness Control
      7. 6.3.7  Undervoltage Lockout
      8. 6.3.8  Overvoltage Protection
      9. 6.3.9  Overcurrent Protection
      10. 6.3.10 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 One-Wire Digital Interface (EasyScale Interface)
      2. 6.4.2 PWM Control Interface
    5. 6.5 Programming
      1. 6.5.1 EasyScale Programming
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Schottky Diode Selection
        3. 7.2.2.3 Compensation Capacitor Selection
        4. 7.2.2.4 Output Capacitor Selection
      3. 7.2.3 Application Curves
      4. 7.2.4 Additional Application Circuits
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Related Links
    3. 8.3 Community Resources
    4. 8.4 Trademarks
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision A (June 2015) to Revision B (May 2024)

  • Updated Device InformationTableGo

Changes from Revision * (November 2013) to Revision A (May 2015)

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description , Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sections; Go
  • Deleted Ordering Information Go