SLVS790E November   2007  – April 2019 TPS61165

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Soft Start-Up
      2. 8.3.2 Open LED Protection
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Maximum Output Current
      2. 9.1.2 Inductor Selection
      3. 9.1.3 Schottky Diode Selection
      4. 9.1.4 Compensation Capacitor Selection
      5. 9.1.5 Input and Output Capacitor Selection
    2. 9.2 Typical Applications
      1. 9.2.1 TPS61165 Typical Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 LED Brightness Dimming Mode Selection
          2. 9.2.1.2.2 PWM Brightness Dimming
          3. 9.2.1.2.3 Digital One-Wire Brightness Dimming
          4. 9.2.1.2.4 EasyScale: One-Wire Digital Dimming
          5. 9.2.1.2.5 Current Program
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Additional Application Circuits
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.3 Thermal Considerations

The maximum device junction temperature must be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation of the TPS61165. Calculate the maximum allowable dissipation, PD(max), and keep the actual dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 8:

Equation 8. TPS61165 q8_pdm_lvs790.gif

where

  • TA is the maximum ambient temperature for the application
  • RθJA is the thermal resistance junction-to-ambient given in Thermal Information

The TPS61165 comes in a thermally enhanced QFN package. This package includes a thermal pad that improves the thermal capabilities of the package. The RθJA of the QFN package greatly depends on the PCB layout and thermal pad connection. The thermal pad must be soldered to the analog ground on the PCB. Using thermal vias underneath the thermal pad as illustrated in the layout example. Also see the QFN/SON PCB Attachment application report (SLUA271).